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- W2129122970 abstract "This paper presents a systematic study on Moving-mask UV for 3-D (three- dimensional) micro structuring of positive- and negative-tone thick photoresist and a dedicated UV lithography process simulation. As an application of the moving-mask UV lithography, we propose a novel method to fabricate embedded microfluidic structures using SU-8. Furthermore, we propose a new practical photoresist profile simulation approach adopting the Fast Marching Method to consider the photoresist dissolution vector in the development process. Through a series of moving-mask UV lithography experiments, (1) the capability of the moving-mask UV lithography for 3-D microstructuring, and (2) the validity of the proposed photoresist profile simulation, were successfully confirmed." @default.
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- W2129122970 date "2007-01-01" @default.
- W2129122970 modified "2023-09-25" @default.
- W2129122970 title "Moving-Mask UV Lithography for 3-Dimensional Positive-And Negative-Tone Thick Photoresist Microstructuring" @default.
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- W2129122970 doi "https://doi.org/10.1109/sensor.2007.4300188" @default.
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