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- W2129868529 abstract "Through wafer interconnects (TWI) with diameters greater than 50 mum have the advantage of extremely low contact resistances. The mechanics of the layers inside the TWI has to be well understood order to avoid passivation cracks. Results of simulation and mechanical investigations are discussed in this paper." @default.
- W2129868529 created "2016-06-24" @default.
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- W2129868529 date "2008-04-01" @default.
- W2129868529 modified "2023-09-27" @default.
- W2129868529 title "Passivation integrity investigations for through wafer interconnects" @default.
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- W2129868529 doi "https://doi.org/10.1109/relphy.2008.4558937" @default.
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