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- W2130697593 abstract "The morphology and mechanical properties of epoxy/polyamide/MPD reactive blends with various amount of polyamide were investigated. The cure behaviors, mechanical strengths, and morphological changes of the epoxy blend systems were analyzed by using DSC, UTM, and SEM, respectively. The amount of high soluble polyamide in epoxy ranged from 0 to 30 phr, and the cure reaction occurred at for 30 min. The start and maximum exothermic temperature in heat flows during cure reactions appeared at almost same temperature, indicating that soluble polyamide could rarely hinder the cure reactions. From the SEM images, it was found that the size of separated-phase was very fine about 100-300 nm, and at 20 phr of polyamide the boundary of separated-phase was unclear and the phase revealed co-continuous. By AP plasma treatment of specimen surface, the adhesion strength was increased by 20% due to enhanced surface free energy. By blending 20 phr of polyamide with epoxy, the adhesion strength was increased by 50% due to co-continuous phase in morphology. By considering the surface treatment of specimen and morphological tuning of the blends, it can be expected that the improvement in toughness and excellent adhesion strength can be achieved in structural adhesive systems." @default.
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- W2130697593 date "2009-01-01" @default.
- W2130697593 modified "2023-10-17" @default.
- W2130697593 title "Improvement in Adhesion Properties of Epoxy/Polyamide/MPD Reactive Blends by means of AP Plasma Treatment and Morphological Tuning" @default.
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