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• W2130872218 abstract "Polycrystalline Si-rich films with different stoichiometric compositions were investigated. is superior to and because of its better thermal stability and higher resistivity. Further, polycrystalline has an antidiffusion ability and a low thermal conductivity. As the bottom heating layer, all these appropriate physical properties of polycrystalline contribute to the performance improvements of the phase change memory cell. Thermal simulation was also carried out to support our opinion." @default.
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• W2130872218 date "2008-01-01" @default.
• W2130872218 modified "2023-09-25" @default.
• W2130872218 title "Polycrystalline Si-Rich SiSb[sub x] Bottom Heating Layer for Phase Change Memory" @default.
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• W2130872218 doi "https://doi.org/10.1149/1.2898682" @default.
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