FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2130949272> ?p ?o ?g. }

• W2130949272 endingPage "1619" @default.
• W2130949272 startingPage "1606" @default.
• W2130949272 abstract "Modern 3-D multiprocessor systems-on-chip (MP-SoC) incorporate processing elements (PEs) and memories within die-stacks interconnected using through-silicon vias (TSVs). The resulting power density of these systems necessitates the inclusion of thermal effects in the architecture space exploration stage of the design process. The number and placement of TSVs influences the thermal conductivity in the vertical direction in die-stacks, and consequently these must be considered during thermal analysis. However, the special requirement of keep out zones (KOZs) for TSVs due to mechanical stress considerations complicates the design of the vertical interconnect, potentially impacting its electrical performance as well. This paper presents an integrated methodology that allows for TSV topology exploration to evaluate the best vertical interconnect structure while considering crosstalk, area overheads, and KOZ requirements using an initial system floorplan. After incorporating feedback from the exploration, the resulting vertical interconnect is included within a temperature-power simulation that estimates the thermal profile of the 3-D stack. Within this methodology, a novel power management scheme for 3-D MP-SoCs that considers both temperature as well as positional information and thermal relationships between PEs, while performing dynamic voltage-frequency scaling (DVFS), is introduced. The scheme effectively maintains smooth temperature profiles, decreases fluctuations in voltage-frequency levels, and increases the aggregate frequency of operation at a lower total power dissipation. Further, the scheme is applied to a stack partitioned into voltage islands, where it is shown to match the conventional per-core DVFS schemes in its performance." @default.
• W2130949272 created "2016-06-24" @default.
• W2130949272 creator A5002103815 @default.
• W2130949272 creator A5007782249 @default.
• W2130949272 creator A5019444861 @default.
• W2130949272 creator A5041082811 @default.
• W2130949272 creator A5075075110 @default.
• W2130949272 date "2014-07-01" @default.
• W2130949272 modified "2023-09-28" @default.
• W2130949272 title "System Level Methodology for Interconnect Aware and Temperature Constrained Power Management of 3-D MP-SOCs" @default.
• W2130949272 cites W1541633348 @default.
• W2130949272 cites W1950008012 @default.
• W2130949272 cites W2015917361 @default.
• W2130949272 cites W2038337218 @default.
• W2130949272 cites W2042001115 @default.
• W2130949272 cites W2081379617 @default.
• W2130949272 cites W2100948980 @default.
• W2130949272 cites W2102694790 @default.
• W2130949272 cites W2104225326 @default.
• W2130949272 cites W2109314689 @default.
• W2130949272 cites W2110100243 @default.
• W2130949272 cites W2117656819 @default.
• W2130949272 cites W2117816012 @default.
• W2130949272 cites W2132321891 @default.
• W2130949272 cites W2133279383 @default.
• W2130949272 cites W2133543885 @default.
• W2130949272 cites W2139709694 @default.
• W2130949272 cites W2140746294 @default.
• W2130949272 cites W2142465757 @default.
• W2130949272 cites W2147301454 @default.
• W2130949272 cites W2150206286 @default.
• W2130949272 cites W2158921969 @default.
• W2130949272 cites W2160837841 @default.
• W2130949272 cites W2171990275 @default.
• W2130949272 cites W2555318774 @default.
• W2130949272 cites W3139689176 @default.
• W2130949272 cites W3142386652 @default.
• W2130949272 cites W3142845206 @default.
• W2130949272 cites W4231800022 @default.
• W2130949272 cites W4232751114 @default.
• W2130949272 cites W4232892799 @default.
• W2130949272 cites W4246899207 @default.
• W2130949272 doi "https://doi.org/10.1109/tvlsi.2013.2273003" @default.
• W2130949272 hasPublicationYear "2014" @default.
• W2130949272 type Work @default.
• W2130949272 sameAs 2130949272 @default.
• W2130949272 citedByCount "6" @default.
• W2130949272 countsByYear W21309492722015 @default.
• W2130949272 countsByYear W21309492722017 @default.
• W2130949272 countsByYear W21309492722018 @default.
• W2130949272 countsByYear W21309492722019 @default.
• W2130949272 crossrefType "journal-article" @default.
• W2130949272 hasAuthorship W2130949272A5002103815 @default.
• W2130949272 hasAuthorship W2130949272A5007782249 @default.
• W2130949272 hasAuthorship W2130949272A5019444861 @default.
• W2130949272 hasAuthorship W2130949272A5041082811 @default.
• W2130949272 hasAuthorship W2130949272A5075075110 @default.
• W2130949272 hasConcept C118021083 @default.
• W2130949272 hasConcept C119599485 @default.
• W2130949272 hasConcept C121332964 @default.
• W2130949272 hasConcept C123745756 @default.
• W2130949272 hasConcept C127413603 @default.
• W2130949272 hasConcept C130145326 @default.
• W2130949272 hasConcept C135402231 @default.
• W2130949272 hasConcept C149635348 @default.
• W2130949272 hasConcept C157742956 @default.
• W2130949272 hasConcept C160671074 @default.
• W2130949272 hasConcept C165801399 @default.
• W2130949272 hasConcept C24326235 @default.
• W2130949272 hasConcept C2776221188 @default.
• W2130949272 hasConcept C2777561913 @default.
• W2130949272 hasConcept C41008148 @default.
• W2130949272 hasConcept C44938667 @default.
• W2130949272 hasConcept C45632049 @default.
• W2130949272 hasConcept C76155785 @default.
• W2130949272 hasConcept C97355855 @default.
• W2130949272 hasConceptScore W2130949272C118021083 @default.
• W2130949272 hasConceptScore W2130949272C119599485 @default.
• W2130949272 hasConceptScore W2130949272C121332964 @default.
• W2130949272 hasConceptScore W2130949272C123745756 @default.
• W2130949272 hasConceptScore W2130949272C127413603 @default.
• W2130949272 hasConceptScore W2130949272C130145326 @default.
• W2130949272 hasConceptScore W2130949272C135402231 @default.
• W2130949272 hasConceptScore W2130949272C149635348 @default.
• W2130949272 hasConceptScore W2130949272C157742956 @default.
• W2130949272 hasConceptScore W2130949272C160671074 @default.
• W2130949272 hasConceptScore W2130949272C165801399 @default.
• W2130949272 hasConceptScore W2130949272C24326235 @default.
• W2130949272 hasConceptScore W2130949272C2776221188 @default.
• W2130949272 hasConceptScore W2130949272C2777561913 @default.
• W2130949272 hasConceptScore W2130949272C41008148 @default.
• W2130949272 hasConceptScore W2130949272C44938667 @default.
• W2130949272 hasConceptScore W2130949272C45632049 @default.
• W2130949272 hasConceptScore W2130949272C76155785 @default.
• W2130949272 hasConceptScore W2130949272C97355855 @default.
• W2130949272 hasIssue "7" @default.
• W2130949272 hasLocation W21309492721 @default.
• W2130949272 hasOpenAccess W2130949272 @default.

• next