FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2131667632> ?p ?o ?g. }

• W2131667632 endingPage "D408" @default.
• W2131667632 startingPage "D408" @default.
• W2131667632 abstract "Chemical mechanical polishing (CMP) is widely adopted in producing excellent local and global planarization of microelectronic devices. However, the fundamental mechanisms of material removal and the interactions of the chemical and mechanical effects are not well understood. In the present paper, the contact area of a pad with a wafer is measured in dry and wet conditions in different pH solutions using optical microscopy and Fourier transform infrared spectroscopy, respectively. Pad surface mechanical properties in dry and wet states are also investigated using atomic force microscopy. The results indicate a significant difference in pad surface mechanical properties between dry and wet states, which could be correlated with the CMP removal rates." @default.
• W2131667632 created "2016-06-24" @default.
• W2131667632 creator A5018171257 @default.
• W2131667632 creator A5030890918 @default.
• W2131667632 creator A5055905934 @default.
• W2131667632 creator A5072423966 @default.
• W2131667632 date "2009-01-01" @default.
• W2131667632 modified "2023-10-14" @default.
• W2131667632 title "Impact of Pad–Wafer Contact Area in Chemical Mechanical Polishing" @default.
• W2131667632 cites W1968452177 @default.
• W2131667632 cites W1970618087 @default.
• W2131667632 cites W1970868134 @default.
• W2131667632 cites W1975759764 @default.
• W2131667632 cites W1982500369 @default.
• W2131667632 cites W1982911823 @default.
• W2131667632 cites W1991823929 @default.
• W2131667632 cites W1999059098 @default.
• W2131667632 cites W2013654435 @default.
• W2131667632 cites W2017046665 @default.
• W2131667632 cites W2022324976 @default.
• W2131667632 cites W2023152114 @default.
• W2131667632 cites W2032974119 @default.
• W2131667632 cites W2034563110 @default.
• W2131667632 cites W2036665881 @default.
• W2131667632 cites W2044030655 @default.
• W2131667632 cites W2045975614 @default.
• W2131667632 cites W2049886132 @default.
• W2131667632 cites W2050534596 @default.
• W2131667632 cites W2059637581 @default.
• W2131667632 cites W2066104953 @default.
• W2131667632 cites W2067831050 @default.
• W2131667632 cites W2078261409 @default.
• W2131667632 cites W2082720356 @default.
• W2131667632 cites W2089455109 @default.
• W2131667632 cites W2092900160 @default.
• W2131667632 cites W2093333193 @default.
• W2131667632 cites W2127767984 @default.
• W2131667632 cites W2154996076 @default.
• W2131667632 cites W2169251585 @default.
• W2131667632 doi "https://doi.org/10.1149/1.3186032" @default.
• W2131667632 hasPublicationYear "2009" @default.
• W2131667632 type Work @default.
• W2131667632 sameAs 2131667632 @default.
• W2131667632 citedByCount "21" @default.
• W2131667632 countsByYear W21316676322013 @default.
• W2131667632 countsByYear W21316676322015 @default.
• W2131667632 countsByYear W21316676322016 @default.
• W2131667632 countsByYear W21316676322017 @default.
• W2131667632 countsByYear W21316676322018 @default.
• W2131667632 countsByYear W21316676322020 @default.
• W2131667632 countsByYear W21316676322022 @default.
• W2131667632 countsByYear W21316676322023 @default.
• W2131667632 crossrefType "journal-article" @default.
• W2131667632 hasAuthorship W2131667632A5018171257 @default.
• W2131667632 hasAuthorship W2131667632A5030890918 @default.
• W2131667632 hasAuthorship W2131667632A5055905934 @default.
• W2131667632 hasAuthorship W2131667632A5072423966 @default.
• W2131667632 hasConcept C102951782 @default.
• W2131667632 hasConcept C127413603 @default.
• W2131667632 hasConcept C138113353 @default.
• W2131667632 hasConcept C159985019 @default.
• W2131667632 hasConcept C160671074 @default.
• W2131667632 hasConcept C160892712 @default.
• W2131667632 hasConcept C171250308 @default.
• W2131667632 hasConcept C178790620 @default.
• W2131667632 hasConcept C180088628 @default.
• W2131667632 hasConcept C185592680 @default.
• W2131667632 hasConcept C187937830 @default.
• W2131667632 hasConcept C192562407 @default.
• W2131667632 hasConcept C26771246 @default.
• W2131667632 hasConcept C2780710336 @default.
• W2131667632 hasConcept C33373654 @default.
• W2131667632 hasConcept C42360764 @default.
• W2131667632 hasConcept C77017923 @default.
• W2131667632 hasConceptScore W2131667632C102951782 @default.
• W2131667632 hasConceptScore W2131667632C127413603 @default.
• W2131667632 hasConceptScore W2131667632C138113353 @default.
• W2131667632 hasConceptScore W2131667632C159985019 @default.
• W2131667632 hasConceptScore W2131667632C160671074 @default.
• W2131667632 hasConceptScore W2131667632C160892712 @default.
• W2131667632 hasConceptScore W2131667632C171250308 @default.
• W2131667632 hasConceptScore W2131667632C178790620 @default.
• W2131667632 hasConceptScore W2131667632C180088628 @default.
• W2131667632 hasConceptScore W2131667632C185592680 @default.
• W2131667632 hasConceptScore W2131667632C187937830 @default.
• W2131667632 hasConceptScore W2131667632C192562407 @default.
• W2131667632 hasConceptScore W2131667632C26771246 @default.
• W2131667632 hasConceptScore W2131667632C2780710336 @default.
• W2131667632 hasConceptScore W2131667632C33373654 @default.
• W2131667632 hasConceptScore W2131667632C42360764 @default.
• W2131667632 hasConceptScore W2131667632C77017923 @default.
• W2131667632 hasIssue "10" @default.
• W2131667632 hasLocation W21316676321 @default.
• W2131667632 hasOpenAccess W2131667632 @default.
• W2131667632 hasPrimaryLocation W21316676321 @default.
• W2131667632 hasRelatedWork W2046456942 @default.
• W2131667632 hasRelatedWork W2071216705 @default.
• W2131667632 hasRelatedWork W2131667632 @default.

• next