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- W2131965021 abstract "A case study was conducted to investigate the issues associated with the design and procurement of flip chip test die and corresponding organic substrates. Test wafers were fabricated by an IC supplier and bumped with electroplated eutectic Sn/Pb by a third party. Issues associated with transferring integrated circuit data to printed circuit design software were identified. The bare and bumped wafers were characterized to identify possible criteria for lot qualification. >" @default.
- W2131965021 created "2016-06-24" @default.
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- W2131965021 date "2002-12-17" @default.
- W2131965021 modified "2023-09-24" @default.
- W2131965021 title "Design and procurement of eutectic Sn/Pb solder-bumped flip chip test die and organic substrates" @default.
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- W2131965021 doi "https://doi.org/10.1109/iemt.1994.404677" @default.
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