Matches in SemOpenAlex for { <https://semopenalex.org/work/W2132077355> ?p ?o ?g. }
Showing items 1 to 84 of
84
with 100 items per page.
- W2132077355 abstract "The effect of temperature exposure encountered both during assembly and in fielded products, has a known influence on glass transition temperature of printed-circuit board (PCB) laminate materials. Printed circuit board laminates such as FR4 are composites of epoxy resin with woven fiberglass reinforcement. Interaction between manufacturing process variables that impact the changes in glass transition temperature (T <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>g</sub> ) has been studied. The laminates studied have been broadly classified into high-T <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>g</sub> , and mid-T <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>g</sub> laminates. Different sets of reflow profiles were created by varying the process variables including, time above liquidus, peak temperature, ramp rate and cooling rate. The effect of multiple reflows encountered in normal assembly or board rework has been studied by exposing the assemblies to multiple reflows between 2×-6×. Changes to the glass transition temperature have been classified by measurement of the glass transition temperature were measured via Thermo Mechanical Analysis (TMA). Statistical analysis of the variables has been used to determine the statistical significance of the measured changes for large populations." @default.
- W2132077355 created "2016-06-24" @default.
- W2132077355 creator A5005741380 @default.
- W2132077355 creator A5019175045 @default.
- W2132077355 creator A5032263958 @default.
- W2132077355 creator A5068741078 @default.
- W2132077355 creator A5080142635 @default.
- W2132077355 date "2012-05-01" @default.
- W2132077355 modified "2023-09-27" @default.
- W2132077355 title "Effect of reflow process on glass transition temperature of printed circuit board laminates" @default.
- W2132077355 cites W146884502 @default.
- W2132077355 cites W1983253161 @default.
- W2132077355 cites W2006872267 @default.
- W2132077355 cites W2091730727 @default.
- W2132077355 cites W2117889504 @default.
- W2132077355 cites W2134047631 @default.
- W2132077355 cites W2490601953 @default.
- W2132077355 doi "https://doi.org/10.1109/itherm.2012.6231439" @default.
- W2132077355 hasPublicationYear "2012" @default.
- W2132077355 type Work @default.
- W2132077355 sameAs 2132077355 @default.
- W2132077355 citedByCount "1" @default.
- W2132077355 countsByYear W21320773552018 @default.
- W2132077355 crossrefType "proceedings-article" @default.
- W2132077355 hasAuthorship W2132077355A5005741380 @default.
- W2132077355 hasAuthorship W2132077355A5019175045 @default.
- W2132077355 hasAuthorship W2132077355A5032263958 @default.
- W2132077355 hasAuthorship W2132077355A5068741078 @default.
- W2132077355 hasAuthorship W2132077355A5080142635 @default.
- W2132077355 hasConcept C119599485 @default.
- W2132077355 hasConcept C120793396 @default.
- W2132077355 hasConcept C121332964 @default.
- W2132077355 hasConcept C122865956 @default.
- W2132077355 hasConcept C127413603 @default.
- W2132077355 hasConcept C149635348 @default.
- W2132077355 hasConcept C159985019 @default.
- W2132077355 hasConcept C166595027 @default.
- W2132077355 hasConcept C192562407 @default.
- W2132077355 hasConcept C2776543023 @default.
- W2132077355 hasConcept C41008148 @default.
- W2132077355 hasConcept C521977710 @default.
- W2132077355 hasConcept C72293138 @default.
- W2132077355 hasConcept C97355855 @default.
- W2132077355 hasConceptScore W2132077355C119599485 @default.
- W2132077355 hasConceptScore W2132077355C120793396 @default.
- W2132077355 hasConceptScore W2132077355C121332964 @default.
- W2132077355 hasConceptScore W2132077355C122865956 @default.
- W2132077355 hasConceptScore W2132077355C127413603 @default.
- W2132077355 hasConceptScore W2132077355C149635348 @default.
- W2132077355 hasConceptScore W2132077355C159985019 @default.
- W2132077355 hasConceptScore W2132077355C166595027 @default.
- W2132077355 hasConceptScore W2132077355C192562407 @default.
- W2132077355 hasConceptScore W2132077355C2776543023 @default.
- W2132077355 hasConceptScore W2132077355C41008148 @default.
- W2132077355 hasConceptScore W2132077355C521977710 @default.
- W2132077355 hasConceptScore W2132077355C72293138 @default.
- W2132077355 hasConceptScore W2132077355C97355855 @default.
- W2132077355 hasLocation W21320773551 @default.
- W2132077355 hasOpenAccess W2132077355 @default.
- W2132077355 hasPrimaryLocation W21320773551 @default.
- W2132077355 hasRelatedWork W1562116249 @default.
- W2132077355 hasRelatedWork W1677836804 @default.
- W2132077355 hasRelatedWork W1742127588 @default.
- W2132077355 hasRelatedWork W1962566846 @default.
- W2132077355 hasRelatedWork W1977994556 @default.
- W2132077355 hasRelatedWork W1993001311 @default.
- W2132077355 hasRelatedWork W2001787453 @default.
- W2132077355 hasRelatedWork W2006872267 @default.
- W2132077355 hasRelatedWork W201429547 @default.
- W2132077355 hasRelatedWork W2040158261 @default.
- W2132077355 hasRelatedWork W2059516637 @default.
- W2132077355 hasRelatedWork W2105755285 @default.
- W2132077355 hasRelatedWork W2117889504 @default.
- W2132077355 hasRelatedWork W2156761364 @default.
- W2132077355 hasRelatedWork W2170136137 @default.
- W2132077355 hasRelatedWork W2395631492 @default.
- W2132077355 hasRelatedWork W2541121989 @default.
- W2132077355 hasRelatedWork W2541496805 @default.
- W2132077355 hasRelatedWork W2579018281 @default.
- W2132077355 hasRelatedWork W2526602967 @default.
- W2132077355 isParatext "false" @default.
- W2132077355 isRetracted "false" @default.
- W2132077355 magId "2132077355" @default.
- W2132077355 workType "article" @default.