Matches in SemOpenAlex for { <https://semopenalex.org/work/W2132855099> ?p ?o ?g. }
Showing items 1 to 94 of
94
with 100 items per page.
- W2132855099 abstract "Microelectronic devices are subjected to constantly varying temperature conditions during their operational lifetime, which can lead to their failure. In this study, we examined the impact of thermal cycling on the evolution of stresses in Cu TSVs using synchrotron-based X-ray micro-diffraction. Two test conditions were analyzed: as-received and 1000 cycled samples. The principal and shear stresses in the 1000 cycled sample were five times greater than in the as-received sample. This was attributed to the increased strain hardening upon thermal cycling. The variation in stresses with thermal cycling is a clear indication that the impact of Cu TSV proximity on front-end-of-line (FEOL) device performance will fluctuate throughout the lifetime of the 3D stacked dies, and thus should be accounted for during FEOL keep-out-zone design rule development." @default.
- W2132855099 created "2016-06-24" @default.
- W2132855099 creator A5022917315 @default.
- W2132855099 creator A5059787100 @default.
- W2132855099 creator A5078730262 @default.
- W2132855099 creator A5084920370 @default.
- W2132855099 creator A5086580789 @default.
- W2132855099 date "2014-05-01" @default.
- W2132855099 modified "2023-10-08" @default.
- W2132855099 title "X-ray micro-beam diffraction measurement of the effect of thermal cycling on stress in Cu TSV: A comparative study" @default.
- W2132855099 cites W1915168963 @default.
- W2132855099 cites W1969486543 @default.
- W2132855099 cites W1977713871 @default.
- W2132855099 cites W2004410004 @default.
- W2132855099 cites W2004420027 @default.
- W2132855099 cites W2029246932 @default.
- W2132855099 cites W2032971910 @default.
- W2132855099 cites W2044287221 @default.
- W2132855099 cites W2045102846 @default.
- W2132855099 cites W2052744616 @default.
- W2132855099 cites W2101962937 @default.
- W2132855099 cites W2133543885 @default.
- W2132855099 doi "https://doi.org/10.1109/ectc.2014.6897516" @default.
- W2132855099 hasPublicationYear "2014" @default.
- W2132855099 type Work @default.
- W2132855099 sameAs 2132855099 @default.
- W2132855099 citedByCount "3" @default.
- W2132855099 countsByYear W21328550992015 @default.
- W2132855099 countsByYear W21328550992020 @default.
- W2132855099 crossrefType "proceedings-article" @default.
- W2132855099 hasAuthorship W2132855099A5022917315 @default.
- W2132855099 hasAuthorship W2132855099A5059787100 @default.
- W2132855099 hasAuthorship W2132855099A5078730262 @default.
- W2132855099 hasAuthorship W2132855099A5084920370 @default.
- W2132855099 hasAuthorship W2132855099A5086580789 @default.
- W2132855099 hasConcept C120665830 @default.
- W2132855099 hasConcept C121332964 @default.
- W2132855099 hasConcept C138885662 @default.
- W2132855099 hasConcept C153294291 @default.
- W2132855099 hasConcept C159985019 @default.
- W2132855099 hasConcept C163258240 @default.
- W2132855099 hasConcept C166957645 @default.
- W2132855099 hasConcept C177564732 @default.
- W2132855099 hasConcept C187937830 @default.
- W2132855099 hasConcept C192562407 @default.
- W2132855099 hasConcept C204530211 @default.
- W2132855099 hasConcept C207114421 @default.
- W2132855099 hasConcept C21036866 @default.
- W2132855099 hasConcept C21368211 @default.
- W2132855099 hasConcept C2777900271 @default.
- W2132855099 hasConcept C41895202 @default.
- W2132855099 hasConcept C43214815 @default.
- W2132855099 hasConcept C49040817 @default.
- W2132855099 hasConcept C541528975 @default.
- W2132855099 hasConcept C62520636 @default.
- W2132855099 hasConcept C95457728 @default.
- W2132855099 hasConceptScore W2132855099C120665830 @default.
- W2132855099 hasConceptScore W2132855099C121332964 @default.
- W2132855099 hasConceptScore W2132855099C138885662 @default.
- W2132855099 hasConceptScore W2132855099C153294291 @default.
- W2132855099 hasConceptScore W2132855099C159985019 @default.
- W2132855099 hasConceptScore W2132855099C163258240 @default.
- W2132855099 hasConceptScore W2132855099C166957645 @default.
- W2132855099 hasConceptScore W2132855099C177564732 @default.
- W2132855099 hasConceptScore W2132855099C187937830 @default.
- W2132855099 hasConceptScore W2132855099C192562407 @default.
- W2132855099 hasConceptScore W2132855099C204530211 @default.
- W2132855099 hasConceptScore W2132855099C207114421 @default.
- W2132855099 hasConceptScore W2132855099C21036866 @default.
- W2132855099 hasConceptScore W2132855099C21368211 @default.
- W2132855099 hasConceptScore W2132855099C2777900271 @default.
- W2132855099 hasConceptScore W2132855099C41895202 @default.
- W2132855099 hasConceptScore W2132855099C43214815 @default.
- W2132855099 hasConceptScore W2132855099C49040817 @default.
- W2132855099 hasConceptScore W2132855099C541528975 @default.
- W2132855099 hasConceptScore W2132855099C62520636 @default.
- W2132855099 hasConceptScore W2132855099C95457728 @default.
- W2132855099 hasLocation W21328550991 @default.
- W2132855099 hasOpenAccess W2132855099 @default.
- W2132855099 hasPrimaryLocation W21328550991 @default.
- W2132855099 hasRelatedWork W1719302868 @default.
- W2132855099 hasRelatedWork W2053345174 @default.
- W2132855099 hasRelatedWork W2141907015 @default.
- W2132855099 hasRelatedWork W2278096478 @default.
- W2132855099 hasRelatedWork W2308302873 @default.
- W2132855099 hasRelatedWork W2494378183 @default.
- W2132855099 hasRelatedWork W2545946163 @default.
- W2132855099 hasRelatedWork W4254810789 @default.
- W2132855099 hasRelatedWork W4299816823 @default.
- W2132855099 hasRelatedWork W2105660900 @default.
- W2132855099 isParatext "false" @default.
- W2132855099 isRetracted "false" @default.
- W2132855099 magId "2132855099" @default.
- W2132855099 workType "article" @default.