Matches in SemOpenAlex for { <https://semopenalex.org/work/W2132865897> ?p ?o ?g. }
- W2132865897 abstract "Thermal management in 3D-ICs is a significant constraint, owing to the high heat flux (~200 W/cm2) and the vertical integration density. The vertical inter-layer connections are achieved using the through silicon vias (TSV). The placement and density of these TSVs are restricted by the pitch size, hotspots and fabrication costs. Moreover, the placement of TSVs effects the thermal gradients and the overall interconnect length. In this paper, an optimized architectural framework for the TSV placement with inter-tier liquid cooling is proposed. In particular, the framework introduces a weight-based simulated annealing (WSA) algorithm and incorporates power density in the cost function estimate for a balanced thermal gradient distribution. In addition, we propose a wholistic interconnect length estimate to optimize the TSV placement. The WSA algorithm implemented on MCNC'91 and GSRC benchmarks demonstrates up to 16% reduction in the average area of the chip. Furthermore, TSV rearrangement reduced the overall interconnect length 4%-33% across the MCNC'91 benchmarks." @default.
- W2132865897 created "2016-06-24" @default.
- W2132865897 creator A5063246387 @default.
- W2132865897 creator A5067236813 @default.
- W2132865897 creator A5081727524 @default.
- W2132865897 date "2013-03-01" @default.
- W2132865897 modified "2023-09-27" @default.
- W2132865897 title "Hierarchical optimization of TSV placement with inter-tier liquid cooling in 3D-IC MPSoCs" @default.
- W2132865897 cites W1541633348 @default.
- W2132865897 cites W1774470910 @default.
- W2132865897 cites W1971168221 @default.
- W2132865897 cites W1987293146 @default.
- W2132865897 cites W2004263801 @default.
- W2132865897 cites W2011975736 @default.
- W2132865897 cites W2025331063 @default.
- W2132865897 cites W2071003187 @default.
- W2132865897 cites W2103751315 @default.
- W2132865897 cites W2104478308 @default.
- W2132865897 cites W2108239118 @default.
- W2132865897 cites W2125082141 @default.
- W2132865897 cites W2129664231 @default.
- W2132865897 cites W2138302616 @default.
- W2132865897 cites W2142760988 @default.
- W2132865897 cites W2143034719 @default.
- W2132865897 cites W2143486258 @default.
- W2132865897 cites W2144290729 @default.
- W2132865897 cites W2147301454 @default.
- W2132865897 cites W2150190846 @default.
- W2132865897 cites W2151734895 @default.
- W2132865897 cites W2152965341 @default.
- W2132865897 cites W2158921969 @default.
- W2132865897 cites W2170968537 @default.
- W2132865897 cites W2171200627 @default.
- W2132865897 cites W3141221909 @default.
- W2132865897 cites W3142845206 @default.
- W2132865897 cites W3145752817 @default.
- W2132865897 doi "https://doi.org/10.1109/semi-therm.2013.6526798" @default.
- W2132865897 hasPublicationYear "2013" @default.
- W2132865897 type Work @default.
- W2132865897 sameAs 2132865897 @default.
- W2132865897 citedByCount "5" @default.
- W2132865897 countsByYear W21328658972014 @default.
- W2132865897 countsByYear W21328658972016 @default.
- W2132865897 countsByYear W21328658972017 @default.
- W2132865897 crossrefType "proceedings-article" @default.
- W2132865897 hasAuthorship W2132865897A5063246387 @default.
- W2132865897 hasAuthorship W2132865897A5067236813 @default.
- W2132865897 hasAuthorship W2132865897A5081727524 @default.
- W2132865897 hasConcept C111335779 @default.
- W2132865897 hasConcept C11413529 @default.
- W2132865897 hasConcept C121332964 @default.
- W2132865897 hasConcept C123745756 @default.
- W2132865897 hasConcept C126980161 @default.
- W2132865897 hasConcept C127413603 @default.
- W2132865897 hasConcept C149635348 @default.
- W2132865897 hasConcept C153294291 @default.
- W2132865897 hasConcept C173608175 @default.
- W2132865897 hasConcept C192562407 @default.
- W2132865897 hasConcept C204530211 @default.
- W2132865897 hasConcept C24326235 @default.
- W2132865897 hasConcept C2524010 @default.
- W2132865897 hasConcept C31258907 @default.
- W2132865897 hasConcept C33923547 @default.
- W2132865897 hasConcept C41008148 @default.
- W2132865897 hasConcept C45632049 @default.
- W2132865897 hasConcept C49040817 @default.
- W2132865897 hasConcept C530198007 @default.
- W2132865897 hasConcept C544956773 @default.
- W2132865897 hasConcept C59088047 @default.
- W2132865897 hasConceptScore W2132865897C111335779 @default.
- W2132865897 hasConceptScore W2132865897C11413529 @default.
- W2132865897 hasConceptScore W2132865897C121332964 @default.
- W2132865897 hasConceptScore W2132865897C123745756 @default.
- W2132865897 hasConceptScore W2132865897C126980161 @default.
- W2132865897 hasConceptScore W2132865897C127413603 @default.
- W2132865897 hasConceptScore W2132865897C149635348 @default.
- W2132865897 hasConceptScore W2132865897C153294291 @default.
- W2132865897 hasConceptScore W2132865897C173608175 @default.
- W2132865897 hasConceptScore W2132865897C192562407 @default.
- W2132865897 hasConceptScore W2132865897C204530211 @default.
- W2132865897 hasConceptScore W2132865897C24326235 @default.
- W2132865897 hasConceptScore W2132865897C2524010 @default.
- W2132865897 hasConceptScore W2132865897C31258907 @default.
- W2132865897 hasConceptScore W2132865897C33923547 @default.
- W2132865897 hasConceptScore W2132865897C41008148 @default.
- W2132865897 hasConceptScore W2132865897C45632049 @default.
- W2132865897 hasConceptScore W2132865897C49040817 @default.
- W2132865897 hasConceptScore W2132865897C530198007 @default.
- W2132865897 hasConceptScore W2132865897C544956773 @default.
- W2132865897 hasConceptScore W2132865897C59088047 @default.
- W2132865897 hasLocation W21328658971 @default.
- W2132865897 hasOpenAccess W2132865897 @default.
- W2132865897 hasPrimaryLocation W21328658971 @default.
- W2132865897 hasRelatedWork W1595166940 @default.
- W2132865897 hasRelatedWork W1953929790 @default.
- W2132865897 hasRelatedWork W1969490691 @default.
- W2132865897 hasRelatedWork W1978639190 @default.
- W2132865897 hasRelatedWork W1983938364 @default.
- W2132865897 hasRelatedWork W2002967711 @default.
- W2132865897 hasRelatedWork W2021910166 @default.