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- W2133647455 abstract "On the past few years, copper CVD has been intensively studied. Highly conformal deposition processes become necessary for the high aspect ratio expected at the deep submicron technology. The present work report promising results in the development of an Cu-CVD process suitable for industrial application in the 0.25 /spl mu/m device technology and below." @default.
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- W2133647455 date "1997-11-01" @default.
- W2133647455 modified "2023-10-18" @default.
- W2133647455 title "CVD process for copper interconnection" @default.
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- W2133647455 doi "https://doi.org/10.1016/s0167-9317(97)00098-1" @default.
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