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• W2134018077 abstract "There are many challenges to overcome including cost-effective manufacturing and assembly as well as the low-k reliability in the flip-chip chip scale package(FCCSP). In particular, a technology to achieve reliability of a low-k dielectric is the key to robust interconnection design in FCCSP. The main purpose of the present study is to design optimum interconnection structure in the fine pitch FCCSP for the low-k dielectric. Finite element analysis(FEA) and the Taguchi method are used with fine pitch of 90μm and 100μm under thermo-mechanical loading in a FCCSP. The normal and shear stress of the interconnection are calculated to predict reliability of a low-k dielectric with various conditions (interconnection structures and PCB structure). Normal and shear stress of low-k as well as FCCSP warpage and displacement difference between a chip and a substrate are analyzed to understand a correlation the low-k reliability and the thermo-mechanical deformation of FCCSP. Four interconnection design factors(structures, diameter, height and solder volume) are used with three levels in the Taguchi method. The normal and shear stress of a low-k dielectric is low as FCCSP warpage and displacement difference between a chip and a substrate decreases, respectively. In the Taguchi method, a comparison among interconnections structures(a copper pillar-solder(Sn0.7Cu)-copper pillar, a copper pillar-solder(Sn0.7Cu), a solder(Sn0.7Cu)-copper pillar) reveals that low-k stress can be low with low solder volume. Specially, a solder to a chip side was more advantage rather than to a substrate side for low stress of a low-k dielectric. The normal stress of a low-k dielectric could be reduced with interconnection height of 60μm and diameter of 60μm. However, shear stress is low with diameter of 40μm. Finally, the plastic strain energy density(PSED) of the solder joints was calculated as PCB layer structures. From this result, package reliability may be overestimated if the package is modeled with one layer of PCB. Therefore, it is suggested that multiple layers of PCB be modeled in FEA to improve the accuracy of thermal package deformation. These studies will be presented in details including FEA and experimental tests. In the near future, to reduce stress in the low-k dielectric it is recommended that the optimized copper interconnection volume be determined considering all materials in a FCCSP for better package reliability. The reliability of a Low-k dielectric can be predicted without time delay by this study results at package level." @default.
• W2134018077 created "2016-06-24" @default.
• W2134018077 creator A5041233983 @default.
• W2134018077 creator A5049698155 @default.
• W2134018077 creator A5061237876 @default.
• W2134018077 creator A5067295856 @default.
• W2134018077 creator A5073276900 @default.
• W2134018077 creator A5089712556 @default.
• W2134018077 date "2011-05-01" @default.
• W2134018077 modified "2023-09-25" @default.
• W2134018077 title "Optimization of interconnections structure in the fine pitch FCCSP for low-k dielectric reliability" @default.
• W2134018077 cites W1496992340 @default.
• W2134018077 cites W1662471680 @default.
• W2134018077 cites W2012331455 @default.
• W2134018077 cites W2014064037 @default.
• W2134018077 cites W2036437978 @default.
• W2134018077 cites W2053625788 @default.
• W2134018077 cites W2059966192 @default.
• W2134018077 cites W2094460552 @default.
• W2134018077 cites W2098986515 @default.
• W2134018077 cites W2127750043 @default.
• W2134018077 cites W2136769379 @default.
• W2134018077 cites W2138993883 @default.
• W2134018077 cites W2161913038 @default.
• W2134018077 cites W2170136137 @default.
• W2134018077 doi "https://doi.org/10.1109/ectc.2011.5898618" @default.
• W2134018077 hasPublicationYear "2011" @default.
• W2134018077 type Work @default.
• W2134018077 sameAs 2134018077 @default.
• W2134018077 citedByCount "1" @default.
• W2134018077 countsByYear W21340180772019 @default.
• W2134018077 crossrefType "proceedings-article" @default.
• W2134018077 hasAuthorship W2134018077A5041233983 @default.
• W2134018077 hasAuthorship W2134018077A5049698155 @default.
• W2134018077 hasAuthorship W2134018077A5061237876 @default.
• W2134018077 hasAuthorship W2134018077A5067295856 @default.
• W2134018077 hasAuthorship W2134018077A5073276900 @default.
• W2134018077 hasAuthorship W2134018077A5089712556 @default.
• W2134018077 hasConcept C121332964 @default.
• W2134018077 hasConcept C123745756 @default.
• W2134018077 hasConcept C127413603 @default.
• W2134018077 hasConcept C133386390 @default.
• W2134018077 hasConcept C135628077 @default.
• W2134018077 hasConcept C138885662 @default.
• W2134018077 hasConcept C159985019 @default.
• W2134018077 hasConcept C163258240 @default.
• W2134018077 hasConcept C192562407 @default.
• W2134018077 hasConcept C21036866 @default.
• W2134018077 hasConcept C21141959 @default.
• W2134018077 hasConcept C24326235 @default.
• W2134018077 hasConcept C2779227376 @default.
• W2134018077 hasConcept C2779866884 @default.
• W2134018077 hasConcept C41895202 @default.
• W2134018077 hasConcept C43214815 @default.
• W2134018077 hasConcept C49040817 @default.
• W2134018077 hasConcept C50296614 @default.
• W2134018077 hasConcept C62520636 @default.
• W2134018077 hasConcept C66938386 @default.
• W2134018077 hasConcept C68928338 @default.
• W2134018077 hasConcept C76155785 @default.
• W2134018077 hasConcept C79072407 @default.
• W2134018077 hasConcept C83469408 @default.
• W2134018077 hasConceptScore W2134018077C121332964 @default.
• W2134018077 hasConceptScore W2134018077C123745756 @default.
• W2134018077 hasConceptScore W2134018077C127413603 @default.
• W2134018077 hasConceptScore W2134018077C133386390 @default.
• W2134018077 hasConceptScore W2134018077C135628077 @default.
• W2134018077 hasConceptScore W2134018077C138885662 @default.
• W2134018077 hasConceptScore W2134018077C159985019 @default.
• W2134018077 hasConceptScore W2134018077C163258240 @default.
• W2134018077 hasConceptScore W2134018077C192562407 @default.
• W2134018077 hasConceptScore W2134018077C21036866 @default.
• W2134018077 hasConceptScore W2134018077C21141959 @default.
• W2134018077 hasConceptScore W2134018077C24326235 @default.
• W2134018077 hasConceptScore W2134018077C2779227376 @default.
• W2134018077 hasConceptScore W2134018077C2779866884 @default.
• W2134018077 hasConceptScore W2134018077C41895202 @default.
• W2134018077 hasConceptScore W2134018077C43214815 @default.
• W2134018077 hasConceptScore W2134018077C49040817 @default.
• W2134018077 hasConceptScore W2134018077C50296614 @default.
• W2134018077 hasConceptScore W2134018077C62520636 @default.
• W2134018077 hasConceptScore W2134018077C66938386 @default.
• W2134018077 hasConceptScore W2134018077C68928338 @default.
• W2134018077 hasConceptScore W2134018077C76155785 @default.
• W2134018077 hasConceptScore W2134018077C79072407 @default.
• W2134018077 hasConceptScore W2134018077C83469408 @default.
• W2134018077 hasLocation W21340180771 @default.
• W2134018077 hasOpenAccess W2134018077 @default.
• W2134018077 hasPrimaryLocation W21340180771 @default.
• W2134018077 hasRelatedWork W1573951671 @default.
• W2134018077 hasRelatedWork W1642841660 @default.
• W2134018077 hasRelatedWork W1844957096 @default.
• W2134018077 hasRelatedWork W1968451489 @default.
• W2134018077 hasRelatedWork W1972553184 @default.
• W2134018077 hasRelatedWork W1977194182 @default.
• W2134018077 hasRelatedWork W1997289721 @default.
• W2134018077 hasRelatedWork W2008314620 @default.
• W2134018077 hasRelatedWork W2021825083 @default.
• W2134018077 hasRelatedWork W2085161726 @default.
• W2134018077 hasRelatedWork W2110064750 @default.

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