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- W2134447416 abstract "Abstract The lead free Sn–Ag– y %Cu ( y = 0.0, 0.5, 1.0 and 2.0) interconnect interfacial microstructures and the microstructure evolution under thermal treatment (isothermal aging, 150 °C/1000 h) were studied in detail by using surface microetching microscopy and cross section microscopy. The corresponding mechanical and reliability behaviors were evaluated by performing shear test and fracture mode analysis before and after the thermal treatment. The results indicate: (i) The interconnects could have different microstructures and intermetallic compound (IMC), depending on the Cu content. The Cu–Sn IMC could have microstructures that were clusters or protrusion-like, Augustine grass leaf-like, scissor-like, tweezers-like, etc. (ii) Ag 3 Sn IMCs were not observed at time zero for any interconnect groups, but they occurred after the aging for all groups. The Ag 3 Sn IMC could have different microstructures, again depending on Cu content. For low Cu content, the Ag 3 Sn IMCs were granules or nodules; for higher Cu content, Ag 3 Sn IMCs were plate-like. (iii) The growth of Ag 3 Sn plates was promoted by the growth of Cu–Sn IMCs, but indirectly linked to the Cu content. (iv) High Cu content (1.0 wt% and higher) could degrade the mechanical and reliability performances of the LF interconnect by providing a brittle joint, which was mainly achieved through the substantial growth of Cu–Sn IMCs and Ag 3 Sn plates." @default.
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- W2134447416 date "2006-07-01" @default.
- W2134447416 modified "2023-10-18" @default.
- W2134447416 title "Microstructure evolution of the Sn–Ag–y%Cu interconnect" @default.
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- W2134447416 doi "https://doi.org/10.1016/j.microrel.2005.08.004" @default.
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