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- W2135032936 abstract "Samples containing 50 mol% SiC and 50 mol% AIN were fabricated to neartheoretical density by hot-pressing in graphite dies in N2 atmosphere. Grain size was varied by varying the hot-pressing conditions. Bar-shaped samples cut from the billets were subjected to creep deformation in four-point bending. Creep was found to depend upon the grain size with coarse-grained material exhibiting lower creep rate. The stress exponent was ∼2.0." @default.
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- W2135032936 date "1986-11-01" @default.
- W2135032936 modified "2023-10-11" @default.
- W2135032936 title "Elevated-Temperature Creep of Silicon Carbide-Aluminum Nitride Ceramics: Role of Grain Size" @default.
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- W2135032936 doi "https://doi.org/10.1111/j.1151-2916.1986.tb07376.x" @default.
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