FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2135445096> ?p ?o ?g. }

• W2135445096 endingPage "628" @default.
• W2135445096 startingPage "621" @default.
• W2135445096 abstract "The thermal stress induced by the coefficient of thermal expansion mismatch between a silicon integrated circuit and an organic substrate is an important reliability issue for chip-to-substrate connections. Copper pillar chip-to-substrate connections, including solder-capped and all-copper pillars, are potential replacements for solder balls with underfill in flip-chip applications. The thermal stresses associated with copper pillar connections are a function of the shape, dimensions, and materials for copper pillars and their associated chip and substrate terminations. In this paper, the design of the copper pillar, chip-to-substrate connections has been studied using finite element analysis. A 3-D, half generalized plane deformation slice model is used to study the static thermal stress at elevated temperature. The design parameters include the shape and material of the pads at the terminus of the copper pillars and the nature of supporting collar around the pillar. The modeling results show that a chip-pad helps to lower the maximum thermal stress within the silicon die. Moreover, a supporting collar around the copper pillars serves to decrease the maximum thermal stress on the silicon die. A high-modulus polymer collar around the copper pillar serves to lower the stress at the pillar-to-chip-pad junction and increase the stress within the center of the pillar. The maximum thermal stress within the die was lowered from 160 MPa to 100 MPa by increasing the elastic modulus of the collar from 1.2 GPa to 11.8 GPa." @default.
• W2135445096 created "2016-06-24" @default.
• W2135445096 creator A5040153848 @default.
• W2135445096 creator A5051789763 @default.
• W2135445096 date "2010-09-01" @default.
• W2135445096 modified "2023-09-26" @default.
• W2135445096 title "Thermal-Mechanical Stress Modeling of Copper Chip-to-Substrate Pillar Connections" @default.
• W2135445096 cites W1963490782 @default.
• W2135445096 cites W1967401986 @default.
• W2135445096 cites W2010033440 @default.
• W2135445096 cites W2012019750 @default.
• W2135445096 cites W2037646001 @default.
• W2135445096 cites W2039625948 @default.
• W2135445096 cites W2051909620 @default.
• W2135445096 cites W2052383107 @default.
• W2135445096 cites W2053625788 @default.
• W2135445096 cites W2064390073 @default.
• W2135445096 cites W2073466047 @default.
• W2135445096 cites W2094460552 @default.
• W2135445096 cites W2101075507 @default.
• W2135445096 cites W2125266502 @default.
• W2135445096 cites W2133504050 @default.
• W2135445096 cites W2141497397 @default.
• W2135445096 cites W2153884005 @default.
• W2135445096 cites W2155721264 @default.
• W2135445096 cites W2158045224 @default.
• W2135445096 cites W2168506183 @default.
• W2135445096 cites W2172764390 @default.
• W2135445096 doi "https://doi.org/10.1109/tcapt.2010.2050888" @default.
• W2135445096 hasPublicationYear "2010" @default.
• W2135445096 type Work @default.
• W2135445096 sameAs 2135445096 @default.
• W2135445096 citedByCount "9" @default.
• W2135445096 countsByYear W21354450962012 @default.
• W2135445096 countsByYear W21354450962014 @default.
• W2135445096 countsByYear W21354450962015 @default.
• W2135445096 countsByYear W21354450962016 @default.
• W2135445096 countsByYear W21354450962019 @default.
• W2135445096 countsByYear W21354450962022 @default.
• W2135445096 crossrefType "journal-article" @default.
• W2135445096 hasAuthorship W2135445096A5040153848 @default.
• W2135445096 hasAuthorship W2135445096A5051789763 @default.
• W2135445096 hasConcept C111106434 @default.
• W2135445096 hasConcept C111368507 @default.
• W2135445096 hasConcept C125619702 @default.
• W2135445096 hasConcept C127313418 @default.
• W2135445096 hasConcept C138885662 @default.
• W2135445096 hasConcept C159985019 @default.
• W2135445096 hasConcept C171250308 @default.
• W2135445096 hasConcept C191897082 @default.
• W2135445096 hasConcept C192562407 @default.
• W2135445096 hasConcept C21036866 @default.
• W2135445096 hasConcept C2777289219 @default.
• W2135445096 hasConcept C2779227376 @default.
• W2135445096 hasConcept C41895202 @default.
• W2135445096 hasConcept C47463417 @default.
• W2135445096 hasConcept C50296614 @default.
• W2135445096 hasConcept C544778455 @default.
• W2135445096 hasConcept C544956773 @default.
• W2135445096 hasConcept C68928338 @default.
• W2135445096 hasConcept C79072407 @default.
• W2135445096 hasConceptScore W2135445096C111106434 @default.
• W2135445096 hasConceptScore W2135445096C111368507 @default.
• W2135445096 hasConceptScore W2135445096C125619702 @default.
• W2135445096 hasConceptScore W2135445096C127313418 @default.
• W2135445096 hasConceptScore W2135445096C138885662 @default.
• W2135445096 hasConceptScore W2135445096C159985019 @default.
• W2135445096 hasConceptScore W2135445096C171250308 @default.
• W2135445096 hasConceptScore W2135445096C191897082 @default.
• W2135445096 hasConceptScore W2135445096C192562407 @default.
• W2135445096 hasConceptScore W2135445096C21036866 @default.
• W2135445096 hasConceptScore W2135445096C2777289219 @default.
• W2135445096 hasConceptScore W2135445096C2779227376 @default.
• W2135445096 hasConceptScore W2135445096C41895202 @default.
• W2135445096 hasConceptScore W2135445096C47463417 @default.
• W2135445096 hasConceptScore W2135445096C50296614 @default.
• W2135445096 hasConceptScore W2135445096C544778455 @default.
• W2135445096 hasConceptScore W2135445096C544956773 @default.
• W2135445096 hasConceptScore W2135445096C68928338 @default.
• W2135445096 hasConceptScore W2135445096C79072407 @default.
• W2135445096 hasIssue "3" @default.
• W2135445096 hasLocation W21354450961 @default.
• W2135445096 hasOpenAccess W2135445096 @default.
• W2135445096 hasPrimaryLocation W21354450961 @default.
• W2135445096 hasRelatedWork W1968370839 @default.
• W2135445096 hasRelatedWork W1978050941 @default.
• W2135445096 hasRelatedWork W1997090418 @default.
• W2135445096 hasRelatedWork W2006759753 @default.
• W2135445096 hasRelatedWork W2014703184 @default.
• W2135445096 hasRelatedWork W2033607746 @default.
• W2135445096 hasRelatedWork W2062323033 @default.
• W2135445096 hasRelatedWork W2095042886 @default.
• W2135445096 hasRelatedWork W2105762484 @default.
• W2135445096 hasRelatedWork W2107249896 @default.
• W2135445096 hasRelatedWork W2115207556 @default.
• W2135445096 hasRelatedWork W2139160853 @default.
• W2135445096 hasRelatedWork W2196210693 @default.
• W2135445096 hasRelatedWork W2271605840 @default.

• next