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• W2135488595 abstract "TSV interposer has emerged as a good solution to provide high wiring density interconnections, improved electrical performance due to shorter interconnection from the die to substrate, and minimized CTE mismatch between the chip and copper filled TSV interposer, resulting in high reliability micro bumps and more reliable low-k chip. Furthermore, for an interposer that does not contain any active device, already established process technology could be applied, TSV pitch could be coarser and a thicker interposer could be used. This paper presents the development of TSV interposer technology for a high-performance 28nm logic die that is mounted on a large silicon interposer with Cu through silicon via. A representative silicon interposer test chip with thousands of micro-bumps at 45um pitch has been fabricated. The silicon interposer is 100um thick, and is mounted on a 42.5mm×42.5mm substrate through 180um pitch C4 bumps. TSV fabrication process steps and assembly process of the large logic die mounted on the TSV interposer with lead-free micro-bumps have been optimized as well as assembly of the component on the organic substrate. 3D thermal-mechanical modeling and simulation for the packaged device with TSV interposer have been performed. The samples have been subjected to thermal cycling, electro-migration and moisture sensitivity tests. Effect of TSV interposer on the stress of the die, low-k layers and fatigue life of micro bumps and C4 bumps have been investigated. Several DOEs have been performed to optimize design and material selection in order to maximize yield and reliability. Finally, Si interposer seemed to be a low-risk 3D path to have a reliable package with acceptable warpage/coplanarity, passing 1000TCB without any crack, delamination or void being detected in low-k, TSV, micro bumps and C4 bumps." @default.
• W2135488595 created "2016-06-24" @default.
• W2135488595 creator A5022945919 @default.
• W2135488595 creator A5031047000 @default.
• W2135488595 creator A5033868480 @default.
• W2135488595 creator A5091912460 @default.
• W2135488595 date "2011-05-01" @default.
• W2135488595 modified "2023-09-29" @default.
• W2135488595 title "Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA" @default.
• W2135488595 cites W2054021075 @default.
• W2135488595 cites W2136312589 @default.
• W2135488595 cites W2141355301 @default.
• W2135488595 cites W2156698020 @default.
• W2135488595 doi "https://doi.org/10.1109/ectc.2011.5898527" @default.
• W2135488595 hasPublicationYear "2011" @default.
• W2135488595 type Work @default.
• W2135488595 sameAs 2135488595 @default.
• W2135488595 citedByCount "133" @default.
• W2135488595 countsByYear W21354885952012 @default.
• W2135488595 countsByYear W21354885952013 @default.
• W2135488595 countsByYear W21354885952014 @default.
• W2135488595 countsByYear W21354885952015 @default.
• W2135488595 countsByYear W21354885952016 @default.
• W2135488595 countsByYear W21354885952017 @default.
• W2135488595 countsByYear W21354885952018 @default.
• W2135488595 countsByYear W21354885952019 @default.
• W2135488595 countsByYear W21354885952020 @default.
• W2135488595 countsByYear W21354885952021 @default.
• W2135488595 countsByYear W21354885952022 @default.
• W2135488595 countsByYear W21354885952023 @default.
• W2135488595 crossrefType "proceedings-article" @default.
• W2135488595 hasAuthorship W2135488595A5022945919 @default.
• W2135488595 hasAuthorship W2135488595A5031047000 @default.
• W2135488595 hasAuthorship W2135488595A5033868480 @default.
• W2135488595 hasAuthorship W2135488595A5091912460 @default.
• W2135488595 hasConcept C100460472 @default.
• W2135488595 hasConcept C111106434 @default.
• W2135488595 hasConcept C111368507 @default.
• W2135488595 hasConcept C119599485 @default.
• W2135488595 hasConcept C121332964 @default.
• W2135488595 hasConcept C123745756 @default.
• W2135488595 hasConcept C127313418 @default.
• W2135488595 hasConcept C127413603 @default.
• W2135488595 hasConcept C153294291 @default.
• W2135488595 hasConcept C158802814 @default.
• W2135488595 hasConcept C159985019 @default.
• W2135488595 hasConcept C163258240 @default.
• W2135488595 hasConcept C165005293 @default.
• W2135488595 hasConcept C171250308 @default.
• W2135488595 hasConcept C177564732 @default.
• W2135488595 hasConcept C192562407 @default.
• W2135488595 hasConcept C204530211 @default.
• W2135488595 hasConcept C24326235 @default.
• W2135488595 hasConcept C2777289219 @default.
• W2135488595 hasConcept C2779227376 @default.
• W2135488595 hasConcept C31258907 @default.
• W2135488595 hasConcept C41008148 @default.
• W2135488595 hasConcept C43214815 @default.
• W2135488595 hasConcept C45632049 @default.
• W2135488595 hasConcept C49040817 @default.
• W2135488595 hasConcept C530198007 @default.
• W2135488595 hasConcept C544956773 @default.
• W2135488595 hasConcept C59088047 @default.
• W2135488595 hasConcept C62520636 @default.
• W2135488595 hasConceptScore W2135488595C100460472 @default.
• W2135488595 hasConceptScore W2135488595C111106434 @default.
• W2135488595 hasConceptScore W2135488595C111368507 @default.
• W2135488595 hasConceptScore W2135488595C119599485 @default.
• W2135488595 hasConceptScore W2135488595C121332964 @default.
• W2135488595 hasConceptScore W2135488595C123745756 @default.
• W2135488595 hasConceptScore W2135488595C127313418 @default.
• W2135488595 hasConceptScore W2135488595C127413603 @default.
• W2135488595 hasConceptScore W2135488595C153294291 @default.
• W2135488595 hasConceptScore W2135488595C158802814 @default.
• W2135488595 hasConceptScore W2135488595C159985019 @default.
• W2135488595 hasConceptScore W2135488595C163258240 @default.
• W2135488595 hasConceptScore W2135488595C165005293 @default.
• W2135488595 hasConceptScore W2135488595C171250308 @default.
• W2135488595 hasConceptScore W2135488595C177564732 @default.
• W2135488595 hasConceptScore W2135488595C192562407 @default.
• W2135488595 hasConceptScore W2135488595C204530211 @default.
• W2135488595 hasConceptScore W2135488595C24326235 @default.
• W2135488595 hasConceptScore W2135488595C2777289219 @default.
• W2135488595 hasConceptScore W2135488595C2779227376 @default.
• W2135488595 hasConceptScore W2135488595C31258907 @default.
• W2135488595 hasConceptScore W2135488595C41008148 @default.
• W2135488595 hasConceptScore W2135488595C43214815 @default.
• W2135488595 hasConceptScore W2135488595C45632049 @default.
• W2135488595 hasConceptScore W2135488595C49040817 @default.
• W2135488595 hasConceptScore W2135488595C530198007 @default.
• W2135488595 hasConceptScore W2135488595C544956773 @default.
• W2135488595 hasConceptScore W2135488595C59088047 @default.
• W2135488595 hasConceptScore W2135488595C62520636 @default.
• W2135488595 hasLocation W21354885951 @default.
• W2135488595 hasOpenAccess W2135488595 @default.
• W2135488595 hasPrimaryLocation W21354885951 @default.
• W2135488595 hasRelatedWork W1969058128 @default.
• W2135488595 hasRelatedWork W2019002696 @default.
• W2135488595 hasRelatedWork W2044236418 @default.
• W2135488595 hasRelatedWork W2114013244 @default.

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