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- W2135656469 abstract "The paper describes a technique for characterising an FET or an HEMT chip and the enclosing package without the need to separate the two physically. The standard approach of characterising the two parts separately leads to an inaccurate description of the contribution the package makes to the overall electrical characteristics of the packaged device." @default.
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- W2135656469 date "1992-01-01" @default.
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- W2135656469 title "Characterisation of gaas fet and hemt chips and packages for accurate hybrid circuit design" @default.
- W2135656469 doi "https://doi.org/10.1049/ip-h-2.1992.0059" @default.
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