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- W2136081856 abstract "Most bipolar-transistor compact models incorporate some level of self-heating capability in order to determine the impact of thermal effects on circuit performance. Techniques for predicting mutual-thermal-coupling effects, however, are not readily available within most commercial CAD platforms. Presented in this brief is a technique which allows for the easy modification of design-kit-supplied models to predict and optimize mutual thermal coupling using commonly available CAD tools such as <i xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>Cadence</i> and <i xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>Spectre</i> ." @default.
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- W2136081856 date "2009-01-01" @default.
- W2136081856 modified "2023-09-26" @default.
- W2136081856 title "Compact Modeling of Mutual Thermal Coupling for the Optimal Design of SiGe HBT Power Amplifiers" @default.
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- W2136081856 doi "https://doi.org/10.1109/ted.2009.2021365" @default.
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