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• W2137403198 abstract "Light-emitting diodes (LEDs), have materialized as an innovative light source which features energy saving properties, good optical performance and efficacy which is added advantage over orthodox lighting systems. However, the efficacy of the LED is influenced by heat generated at the junction of the LED. Hence, in this study, the thermal and stress analysis of single chip LED package with copper diamond heat slug with dimension of 5mm x 5mm x 1mm was carried out through simulation under natural convection condition. Input power of 0.1W and 1W were applied to the single chip LED model. Result of the simulation indicates that at input power 1W, junction temperature of 107.02 °C and stress of 104.59 MPa were obtained." @default.
• W2137403198 created "2016-06-24" @default.
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• W2137403198 date "2013-07-01" @default.
• W2137403198 modified "2023-09-26" @default.
• W2137403198 title "5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED" @default.
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• W2137403198 doi "https://doi.org/10.1109/ams.2013.17" @default.
• W2137403198 hasPublicationYear "2013" @default.
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