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- W2139823218 abstract "Successful integration of hybrid-orientation substrates into high-volume production requires a layer-transfer process to prepare the substrates. Modifications of SiGen's NanoCleave/spl trade/ layer-transfer process were tested for compatibility to cleave and smooth [110] films, produce multi-stack composites and prepare direct bonded film structures. The technology has the promise to be a viable manufacturing process for strained and unstrained hybrid-orientation substrates used for deep submicron mobility enhancement." @default.
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- W2139823218 date "2006-01-05" @default.
- W2139823218 modified "2023-09-26" @default.
- W2139823218 title "Layer-Transfer Process Modifications for Fabricating Hybrid Crystal Orientation Engineered Substrates" @default.
- W2139823218 doi "https://doi.org/10.1109/soi.2005.1563560" @default.
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