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• W2140807890 abstract "This paper reports a simpler technique for fabricating an microelectromechanical system acoustic sensor based on a piezoelectric zinc oxide (ZnO) thin film, utilizing silicon-on-insulator wafers. A highly <i xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>c</i> -axis-oriented ZnO film of thickness 2.4 μm, which is covered with 0.2-μm-thick PECVD SiO <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> , is sandwiched between two aluminum electrodes on a 25- μm-thick silicon diaphragm. This diaphragm thickness has been optimized to withstand sound pressure level range of 120-160 dB. Stress distribution studies using ANSYS have been performed to determine the locations for placement of capacitor electrodes. This paper also reports a technique for the creation of a positive slope of the ZnO step to ensure proper coverage during Al metallization. In order to maximize yield, process steps have been developed to avoid the microtunnel blockage by silicon/glass particles. The packaged sensor is found to exhibit a sensitivity of 382 μV/Pa (RMS) in the frequency range from 30 to 8000 Hz, under varying acoustic pressure." @default.
• W2140807890 created "2016-06-24" @default.
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• W2140807890 date "2013-05-01" @default.
• W2140807890 modified "2023-10-15" @default.
• W2140807890 title "Design and Fabrication of Si-Diaphragm, ZnO Piezoelectric Film-Based MEMS Acoustic Sensor Using SOI Wafers" @default.
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• W2140807890 doi "https://doi.org/10.1109/tsm.2013.2238956" @default.
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