FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2140971279> ?p ?o ?g. }

• W2140971279 abstract "The electroless deposited Ni-P (Phosphorus) under bump metallurgy (UBM) layer was fabricated for Sn containing solder bumps. The amount of P in the electroless Ni film was optimized by controlling complexing agents and the pH of plating solution. The interfacial reaction at the electroless Ni UBM/solder interface was investigated in this work. The intermetallic compound (IMC) formed at the interface during solder reflowing was mainly Ni/sub 3/Sn/sub 4/, and a P-rich Ni layer was also formed as a by-product of Ni-Sn reaction between the NiSn IMC and the electroless Ni layer. A 1-4 /spl mu/m of Ni/sub 3/Sn/sub 4/ IMC and a 1800-5000 /spl Aring/ of P-rich Ni layer were formed in less than 10 minutes of solder reflowing depending on solder materials and reflow temperatures. However, less than 1 /spl mu/m thickness of the electroless Ni layer was consumed. It was found that the P-rich Ni layer contains Ni, P and a small amount of Sn (/spl sim/7 at%). The atomic ratio of 3Ni:1P indicates that there is Ni,P phase in the P-rich Ni layer which was verified by the X-ray analysis. No Sn was detected at the electroless Ni layer located just below the P-rich Ni layer. Therefore, the P-rich Ni layer, a by-product layer of Ni-Sn interfacial reaction, is not appropriate for a Sn diffusion barrier at the electroless Ni UBM and Sn containing solders. Because of the fast diffusion of Sn into the P-rich Ni layer, a series of Kirkendall voids were found in the Ni/sub 3/Sn/sub 4/ IMC, just above the P-rich Ni layer during extended solder reflowing. The amount of the Kirkendall voids appeared to be proportional to the growth of the P-rich Ni layer determined by solder reflowing and subsequent annealing processes. Because the Kirkendall voids are considered to be the main cause of the brittle fracture, it is recommended to restrict the growth of the P-rich Ni layer by choosing proper processing conditions. The brittle characteristics of the Ni-Sn IMC and the Kirkendall voids at the electroless Ni UBM-Sn containing solder system cause brittle bump failure which results in a decreased bump adhesion strength." @default.
• W2140971279 created "2016-06-24" @default.
• W2140971279 creator A5012917091 @default.
• W2140971279 creator A5026879812 @default.
• W2140971279 creator A5080735730 @default.
• W2140971279 creator A5085436973 @default.
• W2140971279 creator A5089073038 @default.
• W2140971279 date "2002-11-13" @default.
• W2140971279 modified "2023-09-26" @default.
• W2140971279 title "Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless nickel UBM-solder interface and their effects on flip chip solder joint reliability" @default.
• W2140971279 cites W1991484265 @default.
• W2140971279 cites W2017052401 @default.
• W2140971279 cites W2017526851 @default.
• W2140971279 cites W2019209191 @default.
• W2140971279 cites W2078109311 @default.
• W2140971279 cites W2131722625 @default.
• W2140971279 cites W2327100566 @default.
• W2140971279 cites W2246766482 @default.
• W2140971279 doi "https://doi.org/10.1109/ectc.2001.928003" @default.
• W2140971279 hasPublicationYear "2002" @default.
• W2140971279 type Work @default.
• W2140971279 sameAs 2140971279 @default.
• W2140971279 citedByCount "23" @default.
• W2140971279 countsByYear W21409712792019 @default.
• W2140971279 countsByYear W21409712792021 @default.
• W2140971279 crossrefType "proceedings-article" @default.
• W2140971279 hasAuthorship W2140971279A5012917091 @default.
• W2140971279 hasAuthorship W2140971279A5026879812 @default.
• W2140971279 hasAuthorship W2140971279A5080735730 @default.
• W2140971279 hasAuthorship W2140971279A5085436973 @default.
• W2140971279 hasAuthorship W2140971279A5089073038 @default.
• W2140971279 hasConcept C159985019 @default.
• W2140971279 hasConcept C191897082 @default.
• W2140971279 hasConcept C192562407 @default.
• W2140971279 hasConcept C27501479 @default.
• W2140971279 hasConcept C2778413121 @default.
• W2140971279 hasConcept C2778836790 @default.
• W2140971279 hasConcept C2779227376 @default.
• W2140971279 hasConcept C2780026712 @default.
• W2140971279 hasConcept C50296614 @default.
• W2140971279 hasConcept C504270822 @default.
• W2140971279 hasConcept C68928338 @default.
• W2140971279 hasConcept C79072407 @default.
• W2140971279 hasConceptScore W2140971279C159985019 @default.
• W2140971279 hasConceptScore W2140971279C191897082 @default.
• W2140971279 hasConceptScore W2140971279C192562407 @default.
• W2140971279 hasConceptScore W2140971279C27501479 @default.
• W2140971279 hasConceptScore W2140971279C2778413121 @default.
• W2140971279 hasConceptScore W2140971279C2778836790 @default.
• W2140971279 hasConceptScore W2140971279C2779227376 @default.
• W2140971279 hasConceptScore W2140971279C2780026712 @default.
• W2140971279 hasConceptScore W2140971279C50296614 @default.
• W2140971279 hasConceptScore W2140971279C504270822 @default.
• W2140971279 hasConceptScore W2140971279C68928338 @default.
• W2140971279 hasConceptScore W2140971279C79072407 @default.
• W2140971279 hasLocation W21409712791 @default.
• W2140971279 hasOpenAccess W2140971279 @default.
• W2140971279 hasPrimaryLocation W21409712791 @default.
• W2140971279 hasRelatedWork W1499033383 @default.
• W2140971279 hasRelatedWork W1969944506 @default.
• W2140971279 hasRelatedWork W1974620656 @default.
• W2140971279 hasRelatedWork W1975301199 @default.
• W2140971279 hasRelatedWork W1976831363 @default.
• W2140971279 hasRelatedWork W1993998032 @default.
• W2140971279 hasRelatedWork W2018729307 @default.
• W2140971279 hasRelatedWork W2032083738 @default.
• W2140971279 hasRelatedWork W2042093456 @default.
• W2140971279 hasRelatedWork W2057750209 @default.
• W2140971279 hasRelatedWork W2059523013 @default.
• W2140971279 hasRelatedWork W2078109311 @default.
• W2140971279 hasRelatedWork W2100623814 @default.
• W2140971279 hasRelatedWork W2113857523 @default.
• W2140971279 hasRelatedWork W2124067938 @default.
• W2140971279 hasRelatedWork W2124716290 @default.
• W2140971279 hasRelatedWork W2133895841 @default.
• W2140971279 hasRelatedWork W2154086079 @default.
• W2140971279 hasRelatedWork W2170798770 @default.
• W2140971279 hasRelatedWork W2175269211 @default.
• W2140971279 isParatext "false" @default.
• W2140971279 isRetracted "false" @default.
• W2140971279 magId "2140971279" @default.
• W2140971279 workType "article" @default.