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- W2141421712 abstract "In this work we conducted an in-depth investigation of UV laser drilling of interconnection microvias with a commercially available Q-switched, diode-pumped, solid-state industrial UV. It delivers 355-nm, 40 ns laser pulses. The tested sample was a polished silicon substrate of 250mum thickness and crystal orientation of (111). The effects of laser parameters, like pulse energy, repetition rate and polarization, were studied" @default.
- W2141421712 created "2016-06-24" @default.
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- W2141421712 date "2006-10-01" @default.
- W2141421712 modified "2023-09-26" @default.
- W2141421712 title "Interconnection microvia drilling using solid state UV laser" @default.
- W2141421712 cites W1988258887 @default.
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- W2141421712 doi "https://doi.org/10.1109/leos.2006.279110" @default.
- W2141421712 hasPublicationYear "2006" @default.
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