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- W2141569303 abstract "Electronic assemblies in field use are exposed to a wide range of environmental loads. The interaction of combined loads has to be considered in lifetime estimates of electronic packages. In this paper, we discuss lifetime prediction for lead-free soldered flip chips under vibration load in different temperature environments in terms of solder joint fatigue. Parameters for lifetime modeling are obtained from non-linear and temperature-dependent finite element analysis and lifetime experiments. We introduce temperature dependent coefficients and exponents for the Coffin-Manson-Basquin relationship considering elastic and plastic fatigue behavior. The results indicate that temperature is an important parameter affecting the solder joint vibration fatigue life." @default.
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- W2141569303 date "2009-05-01" @default.
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- W2141569303 title "A solder joint fatigue life model for combined vibration and temperature environments" @default.
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- W2141569303 doi "https://doi.org/10.1109/ectc.2009.5074064" @default.
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