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- W2144156612 abstract "The integration of Poly-Encapsulated LOCOS (PELOX) into a high performance sub-0.5 /spl mu/m thin-film SOI technology is described. The 700 /spl Aring/ (per side) bird's beak encroachment of PELOX eliminates the need for a field implant and results in a significant reduction of the MOSFET narrow width effect. Partially-depleted N+/P+ dual poly gate MOSFET's with 70 /spl Aring/ Tox and 0.35 /spl mu/m Lpoly were fabricated with /spl les/1 /spl mu/m active/isolation pitch. A 40% reduction in power-delay product, compared to bulk CMOS, is achieved with a CMOS ring oscillator propagation-delay of 51 psec at 2 V supply voltage." @default.
- W2144156612 created "2016-06-24" @default.
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- W2144156612 date "2002-11-19" @default.
- W2144156612 modified "2023-09-22" @default.
- W2144156612 title "A PELOX isolated sub-0.5 micron thin-film SOI technology" @default.
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- W2144156612 doi "https://doi.org/10.1109/vlsit.1995.520848" @default.
- W2144156612 hasPublicationYear "2002" @default.
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