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- W2144668210 abstract "Successful implementation of low-cost, reliable, integrated microsystems requires the integration of planar two-dimensional microelectronic circuits with three-dimensional microelectromechanical structures. Over the past several years, many methods for the integration of microcircuits with micromechanical structures have been developed. This review paper will present an overview of these techniques for integrating microelectromechanical structures with microelectronic circuits. The state-of-the-art, limitations and challenges in the realization of such integrated microsystems are discussed." @default.
- W2144668210 created "2016-06-24" @default.
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- W2144668210 date "2002-11-11" @default.
- W2144668210 modified "2023-09-27" @default.
- W2144668210 title "Integration of micromachined devices and microelectronic circuits: techniques and challenges" @default.
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- W2144668210 doi "https://doi.org/10.1109/mwscas.2000.951625" @default.
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