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- W2144827696 endingPage "644" @default.
- W2144827696 startingPage "629" @default.
- W2144827696 abstract "Wafer-level heterogeneous integration technologies for microoptoelectromechanical systems (MOEMS), microelectromechanical systems (MEMS), and nanoelectromechanical systems (NEMS) enable the combination of dissimilar classes of materials and components into single systems. Thus, high-performance materials and subsystems can be combined in ways that would otherwise not be possible, and thereby forming complex and highly integrated micro- or nanosystems. Examples include the integration of high-performance optical, electrical or mechanical materials such as monocrystalline silicon, graphene or III-V materials with integrated electronic circuits. In this paper the state-of-the-art of wafer-level heterogeneous integration technologies suitable for MOEMS, MEMS, and NEMS devices are reviewed. Various heterogeneous MOEMS, MEMS, and NEMS devices that have been described in literature are presented." @default.
- W2144827696 created "2016-06-24" @default.
- W2144827696 creator A5043782835 @default.
- W2144827696 creator A5085711393 @default.
- W2144827696 creator A5087789386 @default.
- W2144827696 date "2011-05-01" @default.
- W2144827696 modified "2023-10-16" @default.
- W2144827696 title "Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS" @default.
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