Matches in SemOpenAlex for { <https://semopenalex.org/work/W2145297065> ?p ?o ?g. }
Showing items 1 to 89 of
89
with 100 items per page.
- W2145297065 abstract "This paper investigated the factors to cause the formation of underfill voids during dispense and cure of underfill in the flip chip technique. The extrusion mechanism of solder bump has been studied in detail. The experimental results show that additional interim-cure processing is an effective way to eliminate ring voids." @default.
- W2145297065 created "2016-06-24" @default.
- W2145297065 creator A5021388854 @default.
- W2145297065 creator A5045500080 @default.
- W2145297065 creator A5076678340 @default.
- W2145297065 date "2005-07-27" @default.
- W2145297065 modified "2023-09-25" @default.
- W2145297065 title "Ring voids and solder extrusion mechanism for flip chip packaging" @default.
- W2145297065 cites W2129551205 @default.
- W2145297065 cites W2131722625 @default.
- W2145297065 cites W3153014723 @default.
- W2145297065 doi "https://doi.org/10.1109/ipfa.2005.1469174" @default.
- W2145297065 hasPublicationYear "2005" @default.
- W2145297065 type Work @default.
- W2145297065 sameAs 2145297065 @default.
- W2145297065 citedByCount "0" @default.
- W2145297065 crossrefType "proceedings-article" @default.
- W2145297065 hasAuthorship W2145297065A5021388854 @default.
- W2145297065 hasAuthorship W2145297065A5045500080 @default.
- W2145297065 hasAuthorship W2145297065A5076678340 @default.
- W2145297065 hasConcept C111106434 @default.
- W2145297065 hasConcept C111472728 @default.
- W2145297065 hasConcept C126233035 @default.
- W2145297065 hasConcept C138885662 @default.
- W2145297065 hasConcept C159985019 @default.
- W2145297065 hasConcept C160671074 @default.
- W2145297065 hasConcept C165005293 @default.
- W2145297065 hasConcept C171250308 @default.
- W2145297065 hasConcept C186260285 @default.
- W2145297065 hasConcept C192562407 @default.
- W2145297065 hasConcept C2778958987 @default.
- W2145297065 hasConcept C2779227376 @default.
- W2145297065 hasConcept C41008148 @default.
- W2145297065 hasConcept C49040817 @default.
- W2145297065 hasConcept C50296614 @default.
- W2145297065 hasConcept C530198007 @default.
- W2145297065 hasConcept C68928338 @default.
- W2145297065 hasConcept C69567186 @default.
- W2145297065 hasConcept C76155785 @default.
- W2145297065 hasConcept C79072407 @default.
- W2145297065 hasConcept C89611455 @default.
- W2145297065 hasConceptScore W2145297065C111106434 @default.
- W2145297065 hasConceptScore W2145297065C111472728 @default.
- W2145297065 hasConceptScore W2145297065C126233035 @default.
- W2145297065 hasConceptScore W2145297065C138885662 @default.
- W2145297065 hasConceptScore W2145297065C159985019 @default.
- W2145297065 hasConceptScore W2145297065C160671074 @default.
- W2145297065 hasConceptScore W2145297065C165005293 @default.
- W2145297065 hasConceptScore W2145297065C171250308 @default.
- W2145297065 hasConceptScore W2145297065C186260285 @default.
- W2145297065 hasConceptScore W2145297065C192562407 @default.
- W2145297065 hasConceptScore W2145297065C2778958987 @default.
- W2145297065 hasConceptScore W2145297065C2779227376 @default.
- W2145297065 hasConceptScore W2145297065C41008148 @default.
- W2145297065 hasConceptScore W2145297065C49040817 @default.
- W2145297065 hasConceptScore W2145297065C50296614 @default.
- W2145297065 hasConceptScore W2145297065C530198007 @default.
- W2145297065 hasConceptScore W2145297065C68928338 @default.
- W2145297065 hasConceptScore W2145297065C69567186 @default.
- W2145297065 hasConceptScore W2145297065C76155785 @default.
- W2145297065 hasConceptScore W2145297065C79072407 @default.
- W2145297065 hasConceptScore W2145297065C89611455 @default.
- W2145297065 hasLocation W21452970651 @default.
- W2145297065 hasOpenAccess W2145297065 @default.
- W2145297065 hasPrimaryLocation W21452970651 @default.
- W2145297065 hasRelatedWork W1488139166 @default.
- W2145297065 hasRelatedWork W1530391261 @default.
- W2145297065 hasRelatedWork W1546139918 @default.
- W2145297065 hasRelatedWork W1941452268 @default.
- W2145297065 hasRelatedWork W2008609724 @default.
- W2145297065 hasRelatedWork W2011225607 @default.
- W2145297065 hasRelatedWork W2046304468 @default.
- W2145297065 hasRelatedWork W2112927638 @default.
- W2145297065 hasRelatedWork W2128585848 @default.
- W2145297065 hasRelatedWork W2131634201 @default.
- W2145297065 hasRelatedWork W2135466007 @default.
- W2145297065 hasRelatedWork W2151320970 @default.
- W2145297065 hasRelatedWork W2159080937 @default.
- W2145297065 hasRelatedWork W2161252780 @default.
- W2145297065 hasRelatedWork W2163745963 @default.
- W2145297065 hasRelatedWork W2164622698 @default.
- W2145297065 hasRelatedWork W2614625177 @default.
- W2145297065 hasRelatedWork W1535150446 @default.
- W2145297065 hasRelatedWork W1555211961 @default.
- W2145297065 hasRelatedWork W2848192495 @default.
- W2145297065 isParatext "false" @default.
- W2145297065 isRetracted "false" @default.
- W2145297065 magId "2145297065" @default.
- W2145297065 workType "article" @default.