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- W2145492022 abstract "The reliability of buried heterostructure laser diodes (BHLDs) that have a dry-etched mesa structure has been improved by about ten times by using optimized HBr-based wet chemical etchants. This improved reliability was achieved by reducing the amount of defects at the regrowth interfaces by using a newly optimized HBr-Br2-H20 solution with a composition range from 0.30 M HBd0.022 M Br2 to 0.50 M HBd0.020 M Br2. Solutions in this range produce the same etching rates of the (710) InP cladding layers and the (110) InGaAsP multi-quantum-well active layer. The etching mechanism of the InGaAsP/InP material system in the HBr-Br2-H20 solutions was found to be an oxide-dissolution reaction." @default.
- W2145492022 created "2016-06-24" @default.
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- W2145492022 date "2001-01-01" @default.
- W2145492022 modified "2023-09-25" @default.
- W2145492022 title "HIGHLY RELIABLE InGaAsP/InP LASERS WITH NEWLY COMPOSED HBr-BASED SOLUTIONS DEFECT-FREE REGROWTH INTERFACES FORMED BY" @default.
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