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- W2145496064 abstract "With constraints on size, cost, reliability, and performance for liquid-based cooling systems, the design of modular micropumps suitable for an integrated thermal management system still remains a challenge. In this paper, the effectiveness of a low-cost valveless micropump—heat exchanger on a printed circuit board is investigated for electronic cooling. Signal conditioning and control electronics are integrated with the fluidic components on the substrate to form a compact modular unit. Piezoelectric actuation and conical diffusers are utilized to generate pulsating flow through a minichannel heat sink. With ethanol as the working fluid, the tested pump reached a maximum flowrate and a pressure head of 2.4 ml/min and 743 Pa at an input voltage of 6 V DC . Suitability of the system for active real-time temperature control has been demonstrated at two input heater power levels of 1.45 and 2.5 W. A maximum reduction of 57 per cent in the average heat sink surface temperature could be achieved at a maximum power consumption of 150 mW by the micropump." @default.
- W2145496064 created "2016-06-24" @default.
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- W2145496064 date "2009-01-16" @default.
- W2145496064 modified "2023-09-27" @default.
- W2145496064 title "Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling" @default.
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- W2145496064 doi "https://doi.org/10.1243/09544062jmes1315" @default.
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