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- W2145785278 abstract "There are various methods to model a power and ground plane pair found in the power distribution networks of IC packages and printed circuit boards. In this paper, three such methods are examined. The simulation results are compared with measurements and the relative merits and drawbacks of these methods are discussed." @default.
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- W2145785278 date "2002-11-11" @default.
- W2145785278 modified "2023-09-24" @default.
- W2145785278 title "A comparative study of different plane modelling methodologies for high density electronic packages" @default.
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- W2145785278 doi "https://doi.org/10.1109/eptc.2000.906375" @default.
- W2145785278 hasPublicationYear "2002" @default.
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