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- W214651164 abstract "70%Si-Al alloy as a novel electronics package material was prepared by spray deposition. HIP technique was adopted in order to density the billet. The prepared 70%Si-Al alloy has a microstructure with fine silicon particles (10-20 μm in diameter) well dispersed in the matrix. The alloy shows excellent comprehensive properties, especially a lower thermal expansion coefficient and a lower density compared with the traditional electronics packaging materials. After HIP, The comprehensive properties of the 70%Si-Al alloy can be further enhanced. The alloy can be machined with the traditional cutting tools and applied as the packaging materials for the power IC, microwave electronic parts and integrate circuit blocks." @default.
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- W214651164 date "2005-12-11" @default.
- W214651164 modified "2023-09-23" @default.
- W214651164 title "STUDY OF NOVEL ELECTRONIC PACKAGING MATERIAL 70%Si-Al PREPARED BY THE SPRAY DEPOSITION" @default.
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