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- W2149013674 abstract "This work describes a simple method for aligning mask features to the crystallographic orientation on [100] silicon wafers. For some micromachined devices more precise alignment than that offered by the wafer flat is required. In order to do this, alignment aids, that can be viewed using a conventional mask aligner or an e-beam lithography system, are etched into the silicon. At the same time as the alignment aids are etched, other features that show which set of alignment aids is most closely aligned to the direction are also etched. Using this method, it is possible to determine the crystal orientation to an accuracy of 0.1/spl deg/, and to align subsequent mask patterns to this." @default.
- W2149013674 created "2016-06-24" @default.
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- W2149013674 date "2005-08-25" @default.
- W2149013674 modified "2023-09-26" @default.
- W2149013674 title "Alignment Of Mask Patterns To Crystal Orientation" @default.
- W2149013674 doi "https://doi.org/10.1109/sensor.1995.717131" @default.
- W2149013674 hasPublicationYear "2005" @default.
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