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- W2149086722 abstract "Oxygen plasma treatment of polyimide and metal interfaces is used to remove undesirable organic contamination and improve adhesion of thin films. The authors present the results of some of the experimental and modeling efforts directed toward understanding the basic physics and chemistry of the plasma systems used in thin-film processing. Measured ion densities are correlated with the observed effects on polyimide etch rates as well as with debris removal and polyimide cracking upon exposure to various plasma systems. Comparisons of predicted oxygen atom flux with the measured carbon atom turn-over number indicated that the main etching species are the O/sup 3/P atoms. However, activation of the polyimide surface by ion bombardment is an essential first step and is the rate-determining process. The polyimide crack threshold is observed to decrease with increasing ion density (decreasing pressure). Plasma-treatment-induced changes of polyimide and metal surfaces have been delineated by XPS (X-ray photoelectron spectroscopy) and Auger spectroscopy and by water contact angle measurements. Surface modification of the polyimide to increase oxygen content resulted in improved wetting and adhesion. The oxidation state of chrome is a strong function of pressure. Plasma processes at 100 mtorr resulted in the formation of a stable Cr/sub 2/O/sub 3/ oxide layer, while a mixture of Cr/sub 2/O/sub 3/ and CrO/sub 3/ is formed at higher pressures.< <ETX xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>></ETX>" @default.
- W2149086722 created "2016-06-24" @default.
- W2149086722 creator A5005089775 @default.
- W2149086722 creator A5029855923 @default.
- W2149086722 creator A5053238582 @default.
- W2149086722 creator A5090117664 @default.
- W2149086722 date "2002-12-04" @default.
- W2149086722 modified "2023-09-27" @default.
- W2149086722 title "Plasma processes for thin film surface treatment" @default.
- W2149086722 cites W1983256684 @default.
- W2149086722 cites W1994645666 @default.
- W2149086722 cites W2006505628 @default.
- W2149086722 cites W2012680728 @default.
- W2149086722 cites W2028816987 @default.
- W2149086722 cites W2076688839 @default.
- W2149086722 doi "https://doi.org/10.1109/ectc.1990.122271" @default.
- W2149086722 hasPublicationYear "2002" @default.
- W2149086722 type Work @default.
- W2149086722 sameAs 2149086722 @default.
- W2149086722 citedByCount "4" @default.
- W2149086722 countsByYear W21490867222015 @default.
- W2149086722 crossrefType "proceedings-article" @default.
- W2149086722 hasAuthorship W2149086722A5005089775 @default.
- W2149086722 hasAuthorship W2149086722A5029855923 @default.
- W2149086722 hasAuthorship W2149086722A5053238582 @default.
- W2149086722 hasAuthorship W2149086722A5090117664 @default.
- W2149086722 hasConcept C113196181 @default.
- W2149086722 hasConcept C127413603 @default.
- W2149086722 hasConcept C134514944 @default.
- W2149086722 hasConcept C159985019 @default.
- W2149086722 hasConcept C171250308 @default.
- W2149086722 hasConcept C175708663 @default.
- W2149086722 hasConcept C178790620 @default.
- W2149086722 hasConcept C185592680 @default.
- W2149086722 hasConcept C19067145 @default.
- W2149086722 hasConcept C191897082 @default.
- W2149086722 hasConcept C192562407 @default.
- W2149086722 hasConcept C2779227376 @default.
- W2149086722 hasConcept C2779851234 @default.
- W2149086722 hasConcept C2780965675 @default.
- W2149086722 hasConcept C42360764 @default.
- W2149086722 hasConcept C544153396 @default.
- W2149086722 hasConcept C6556556 @default.
- W2149086722 hasConceptScore W2149086722C113196181 @default.
- W2149086722 hasConceptScore W2149086722C127413603 @default.
- W2149086722 hasConceptScore W2149086722C134514944 @default.
- W2149086722 hasConceptScore W2149086722C159985019 @default.
- W2149086722 hasConceptScore W2149086722C171250308 @default.
- W2149086722 hasConceptScore W2149086722C175708663 @default.
- W2149086722 hasConceptScore W2149086722C178790620 @default.
- W2149086722 hasConceptScore W2149086722C185592680 @default.
- W2149086722 hasConceptScore W2149086722C19067145 @default.
- W2149086722 hasConceptScore W2149086722C191897082 @default.
- W2149086722 hasConceptScore W2149086722C192562407 @default.
- W2149086722 hasConceptScore W2149086722C2779227376 @default.
- W2149086722 hasConceptScore W2149086722C2779851234 @default.
- W2149086722 hasConceptScore W2149086722C2780965675 @default.
- W2149086722 hasConceptScore W2149086722C42360764 @default.
- W2149086722 hasConceptScore W2149086722C544153396 @default.
- W2149086722 hasConceptScore W2149086722C6556556 @default.
- W2149086722 hasLocation W21490867221 @default.
- W2149086722 hasOpenAccess W2149086722 @default.
- W2149086722 hasPrimaryLocation W21490867221 @default.
- W2149086722 hasRelatedWork W1974298998 @default.
- W2149086722 hasRelatedWork W2014800410 @default.
- W2149086722 hasRelatedWork W2059226727 @default.
- W2149086722 hasRelatedWork W2064772017 @default.
- W2149086722 hasRelatedWork W2081153816 @default.
- W2149086722 hasRelatedWork W2324243188 @default.
- W2149086722 hasRelatedWork W2373991828 @default.
- W2149086722 hasRelatedWork W2995602552 @default.
- W2149086722 hasRelatedWork W3118681934 @default.
- W2149086722 hasRelatedWork W4313462481 @default.
- W2149086722 isParatext "false" @default.
- W2149086722 isRetracted "false" @default.
- W2149086722 magId "2149086722" @default.
- W2149086722 workType "article" @default.