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- W2149111834 abstract "Development of advanced packaging technologies such as Chip Size Packages, Multi Chip Modules and 3D stacks of MCMs has led to a significant reduction in mass and volume of electronics systems. Among these techniques, we develop a vertical integration called Ultra-Thin Chip Stacking interesting for all applications where size and weight reductions are of major importance (portable electronics, biomedical, aerospace...)." @default.
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- W2149111834 date "2003-06-25" @default.
- W2149111834 modified "2023-09-23" @default.
- W2149111834 title "Ultra-thinned chips integration: technological approach and electrical qualification" @default.
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- W2149111834 doi "https://doi.org/10.1109/miel.2002.1003311" @default.
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