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- W2149208688 abstract "The contribution of underfill to the stress in flip chip assemblies was investigated using curvature monitoring of simple underfll-die laminates. From the experimentally measured curvatures, the magnitude and distribution of stresses was calculated using bimetallic beam theory at various levels of complexity, with good agreement among the results. For a range of silica-filled, anhydride-cured epoxies, the stress d was found to comelate roughly with the underfill’s modulus E, glass transition temperature T, and coefficient of thermal expansion a, according to the classic stress index formula: d = E .Aa. AT. In addition, the susceptibility of various underfill formulations to exhibit fillet cracking in a flip-chip test vehicle after thermal cycling was observed to be proponional to the square of the underfill’s stress divided by the stress intensity factor (0 IK,J~, in agreement with a simple model based on linear elastic fracture mechanics." @default.
- W2149208688 created "2016-06-24" @default.
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- W2149208688 date "2004-06-22" @default.
- W2149208688 modified "2023-09-26" @default.
- W2149208688 title "Underfill-induced stresses in flip chip assemblies" @default.
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- W2149208688 doi "https://doi.org/10.1109/ectc.2003.1216406" @default.
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