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- W2149383480 abstract "Ultralight 5 /spl mu/m thick PIN GaAs solar cells were bonded to 3 mm coverglass with 1 mm of adhesive to create very high power density cells for use in ultralight aircraft. Cells were first made on a thick GaAs wafer and then bonded to a coverglass. The GaAs wafer was removed by selectively etching through the wafer to a buried etch stop in the cell epilayers. The cell was completed with a final nonalloyed back metal contact to prevent heat damage to the adhesive, as opposed to a high temperature alloyed contact used in a normal thick p-n GaAs cell. Prototype 1/spl times/1 cm cells were measured by microbalance at an average weight of 0.0228 g/cm/sup 2/ with a one-Sun AMO efficiency up to 17.3% at 28 /spl deg/C (V/sub oc/ 1.024 V, J/sub sc/ 29.9 mA/cm/sup 2/, fill factor 77.4%) for a solar cell power density of 1040 W/kg (weight including coverglass, adhesive and cell)." @default.
- W2149383480 created "2016-06-24" @default.
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- W2149383480 date "1996-01-01" @default.
- W2149383480 modified "2023-10-18" @default.
- W2149383480 title "High-power density (1040 W/kg) GaAs cells for ultralight aircraft" @default.
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- W2149383480 doi "https://doi.org/10.1109/pvsc.1996.563943" @default.
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