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- W2149792502 abstract "This study deals with tensile creep and crack growth behavior of silicon carbide doped with alumina at 1400°C. Excellent creep resistance was observed for stresses from 150 MPa to 200 MPa. From the creep exponent of 1.4 and the activation energy of 320 kj/mol, the principal creep mechanism was Coble creep. The creep failure was caused by slow crack growth from a preexisting flaw. The crack was found to grow subcritically along grain boundaries almost in isolation. The relation between the time–to–failure and the applied stress was well treated by a diffusive crack growth model, and the threshold stress of this material at 1400°C was estimated at 165 MPa." @default.
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- W2149792502 date "1994-03-01" @default.
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- W2149792502 title "Diffusional Crack Growth and Creep Rupture of Silicon Carbide Doped with Alumina" @default.
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- W2149792502 doi "https://doi.org/10.1111/j.1151-2916.1994.tb05348.x" @default.
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