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- W2150095727 abstract "Power gain (f <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>MAX</sub> ) of 350 GHz and cut-off frequency (f <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>T</sub> ) of 280 GHz is demonstrated for 36 nm L <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>poly</sub> devices in a 45 nm bulk CMOS process. A record f <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>T</sub> of 350 GHz (intrinsic f <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>T</sub> 425 GHz), without any loss of f <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>MAX</sub> is seen in 28 nm L <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>poly</sub> devices. Combination of advanced lithography and liner stress effect can be leveraged to further boost f <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>T</sub> and f <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>MAX</sub> by 14% with a relaxed pitch device. Comparison with 90 and 65 nm nodes illustrates the impact of scaling and parasitics." @default.
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- W2150095727 date "2007-06-01" @default.
- W2150095727 modified "2023-09-26" @default.
- W2150095727 title "Technology Scaling and Device Design for 350 GHz RF Performance in a 45nm Bulk CMOS Process" @default.
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- W2150095727 doi "https://doi.org/10.1109/vlsit.2007.4339725" @default.
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