Matches in SemOpenAlex for { <https://semopenalex.org/work/W2150226976> ?p ?o ?g. }
Showing items 1 to 94 of
94
with 100 items per page.
- W2150226976 abstract "This paper systematically discusses environmental effects (temperature and humidity) on the adhesion performance of underfill materials. The adhesion strengths of underfill with passivation materials were measured by die shear tests for various conditions. The adhesion strength between underfill and passivation is not affected significantly after thermal cycling tests for 1000 cycles. Die shear tests at elevated temperatures showed that underfill adhesion strength decreases with increase in test temperature above room temperature. The decreased adhesion strength versus temperature is probably due to the decrease of underfill modulus with increase in temperature. The sharp decrease occurs at a temperature below the glass transition temperature of the underfill. Underfill adhesion strength with different passivation materials decreases after aging in a high temperature/humidity environment. The adhesion degradation after high temperature/humidity aging is dependent on the hydrophilicity of the passivation. Hydrophilic passivation, e.g. SiO/sub 2/ and SiN, shows much more severe adhesion degradation than hydrophobic passivation such as benzocyclobutene and polyimide. It is shown that adhesion stability for hydrophilic passivation can be successfully improved by use of coupling agents such as silane that introduce stable chemical bonds at the interface. Moisture diffusion kinetics into the 2 mm/spl times/2 mm die shear sample were studied. Although the adhesion strength degradation is due to moisture diffusion into the underfill, the adhesion degradation rate of die shear samples during aging at 85/spl deg/C/85% RH is slower than moisture diffusion." @default.
- W2150226976 created "2016-06-24" @default.
- W2150226976 creator A5050650928 @default.
- W2150226976 creator A5061640206 @default.
- W2150226976 date "2002-11-11" @default.
- W2150226976 modified "2023-09-23" @default.
- W2150226976 title "Study on influence of environment on adhesion performance of underfill for flip chip application" @default.
- W2150226976 cites W1740601578 @default.
- W2150226976 cites W1897189970 @default.
- W2150226976 cites W2130574021 @default.
- W2150226976 cites W2132216821 @default.
- W2150226976 cites W2133652536 @default.
- W2150226976 cites W2140906818 @default.
- W2150226976 cites W2143637956 @default.
- W2150226976 cites W2147175618 @default.
- W2150226976 cites W2154450414 @default.
- W2150226976 cites W2164471226 @default.
- W2150226976 cites W2169420366 @default.
- W2150226976 cites W3202239746 @default.
- W2150226976 cites W91130530 @default.
- W2150226976 doi "https://doi.org/10.1109/emap.2000.904162" @default.
- W2150226976 hasPublicationYear "2002" @default.
- W2150226976 type Work @default.
- W2150226976 sameAs 2150226976 @default.
- W2150226976 citedByCount "3" @default.
- W2150226976 countsByYear W21502269762012 @default.
- W2150226976 crossrefType "proceedings-article" @default.
- W2150226976 hasAuthorship W2150226976A5050650928 @default.
- W2150226976 hasAuthorship W2150226976A5061640206 @default.
- W2150226976 hasConcept C121332964 @default.
- W2150226976 hasConcept C127893833 @default.
- W2150226976 hasConcept C151420433 @default.
- W2150226976 hasConcept C153294291 @default.
- W2150226976 hasConcept C159390177 @default.
- W2150226976 hasConcept C159750122 @default.
- W2150226976 hasConcept C159985019 @default.
- W2150226976 hasConcept C177564732 @default.
- W2150226976 hasConcept C192562407 @default.
- W2150226976 hasConcept C204530211 @default.
- W2150226976 hasConcept C2776366733 @default.
- W2150226976 hasConcept C2779227376 @default.
- W2150226976 hasConcept C33574316 @default.
- W2150226976 hasConcept C39432304 @default.
- W2150226976 hasConcept C521977710 @default.
- W2150226976 hasConcept C68928338 @default.
- W2150226976 hasConcept C79072407 @default.
- W2150226976 hasConcept C84416704 @default.
- W2150226976 hasConcept C97355855 @default.
- W2150226976 hasConceptScore W2150226976C121332964 @default.
- W2150226976 hasConceptScore W2150226976C127893833 @default.
- W2150226976 hasConceptScore W2150226976C151420433 @default.
- W2150226976 hasConceptScore W2150226976C153294291 @default.
- W2150226976 hasConceptScore W2150226976C159390177 @default.
- W2150226976 hasConceptScore W2150226976C159750122 @default.
- W2150226976 hasConceptScore W2150226976C159985019 @default.
- W2150226976 hasConceptScore W2150226976C177564732 @default.
- W2150226976 hasConceptScore W2150226976C192562407 @default.
- W2150226976 hasConceptScore W2150226976C204530211 @default.
- W2150226976 hasConceptScore W2150226976C2776366733 @default.
- W2150226976 hasConceptScore W2150226976C2779227376 @default.
- W2150226976 hasConceptScore W2150226976C33574316 @default.
- W2150226976 hasConceptScore W2150226976C39432304 @default.
- W2150226976 hasConceptScore W2150226976C521977710 @default.
- W2150226976 hasConceptScore W2150226976C68928338 @default.
- W2150226976 hasConceptScore W2150226976C79072407 @default.
- W2150226976 hasConceptScore W2150226976C84416704 @default.
- W2150226976 hasConceptScore W2150226976C97355855 @default.
- W2150226976 hasLocation W21502269761 @default.
- W2150226976 hasOpenAccess W2150226976 @default.
- W2150226976 hasPrimaryLocation W21502269761 @default.
- W2150226976 hasRelatedWork W1053681779 @default.
- W2150226976 hasRelatedWork W1905852331 @default.
- W2150226976 hasRelatedWork W1973044248 @default.
- W2150226976 hasRelatedWork W2000940170 @default.
- W2150226976 hasRelatedWork W2006210421 @default.
- W2150226976 hasRelatedWork W2019778633 @default.
- W2150226976 hasRelatedWork W2046535583 @default.
- W2150226976 hasRelatedWork W2056190297 @default.
- W2150226976 hasRelatedWork W2070468475 @default.
- W2150226976 hasRelatedWork W2078217282 @default.
- W2150226976 hasRelatedWork W2082092201 @default.
- W2150226976 hasRelatedWork W2096231474 @default.
- W2150226976 hasRelatedWork W2102233582 @default.
- W2150226976 hasRelatedWork W2132684030 @default.
- W2150226976 hasRelatedWork W2146083090 @default.
- W2150226976 hasRelatedWork W2166045721 @default.
- W2150226976 hasRelatedWork W2170560481 @default.
- W2150226976 hasRelatedWork W3198596392 @default.
- W2150226976 hasRelatedWork W169020257 @default.
- W2150226976 hasRelatedWork W2084102777 @default.
- W2150226976 isParatext "false" @default.
- W2150226976 isRetracted "false" @default.
- W2150226976 magId "2150226976" @default.
- W2150226976 workType "article" @default.