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- W2150417366 abstract "In this study, the junction temperature (T j ) and thermal resistance (R th ) of five high-power multi-chip COB (chip-on-board) LED packages with different chip spacings were compared. The actual T j was measured by an IR camera and compared with the simulation results from a computational fluid dynamics (CFD) software. In addition, the effects of heat slugs with different thermal conductivity, heat sinks of various thicknesses, chip size, and forced convection cooling on the T j and R th of high-powered LED components were investigated. The experimental results show that smaller chip spacing resulted in higher T j and R th . The heat dissipation performance can be improved by using a heat slug with a high thermal conductivity; and increasing the thickness of the heat sink, or employing forced convection cooling." @default.
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- W2150417366 date "2012-02-01" @default.
- W2150417366 modified "2023-09-25" @default.
- W2150417366 title "Efficient Heat Dissipation Design of High-Power Multi-Chip Cob Package Led Modules" @default.
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- W2150417366 doi "https://doi.org/10.4028/www.scientific.net/amr.463-464.1332" @default.
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