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- W2151837802 abstract "We introduce a new low temperature (280°C) parylene-C wafer bonding technique, where parylene-C bonds directly a Pyrex wafer to a silicon wafer with either a Si, SiO <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> or Si <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</sub> N <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>4</sub> surface with a bonding strength up to 23 MPa. The technique uses a single layer of parylene-C deposited only on the Pyrex wafer. Moreover, the process is compatible for bonding any type of wafer with small-sized micropatterned features, or containing microfluidic channels and electrodes. This technique can be an alternative for conventional bonding methods like anodic bonding in applications requiring a low temperature and diverse bonding interfaces." @default.
- W2151837802 created "2016-06-24" @default.
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- W2151837802 date "2011-06-01" @default.
- W2151837802 modified "2023-10-16" @default.
- W2151837802 title "Low temperature Pyrex/silicon wafer bonding via a single intermediate parylene layer" @default.
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- W2151837802 doi "https://doi.org/10.1109/transducers.2011.5969475" @default.
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