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• W2153104964 abstract "In recent years, environmental concerns have attracted more and more attention in many countries due to poisonous elemental of Pb in the traditional lead-based solders. Many countries are about to prohibit the use of lead-bearing solders in microelectronic packaging. Replacement of tin-lead eutectic solders has become a worldwide trend. Among the candidate lead-free solders, SnAg and SnAgCu are the foremost candidates because of their nontoxic nature and better processing performance. Eutectic Sn-3.5Ag solder shows excellent mechanical properties with comparable wetting characteristics with SnPb solders. Its higher melting point makes it more suitable for higher temperature applications. Failure of microelectronic packaging most likely happens due to the poor creep and thermomechanical fatigue properties of solder alloy. Published papers show that composite solders offer improved properties as compared to noncomposite solders. Plating Ni on substrate is commonly used for preventing the interfacial IMC growth in solder joints serving. Ni reinforcement particles were incorporated to solder alloys in current research in order to stabilize the microstructure. In this study, composite solders were prepared by mechanically dispersing approximately 4mum size Ni reinforcement particles into the Sn-3.5Ag solder paste. In order to study the effects of volume fraction of the reinforcing phases, composite solders with 1, 3, 5, 8 and 10 volume percent Ni particles were studied. The single shear lap joints were fabricated using the composite solders. Influence of Ni volume fraction on mechanical properties, wettability and microstructure of solder joints were investigated. The morphology, size and distribution of the reinforcing phases were characterized metallographically. The experimental results show that shear strength of solder joints were increased with the proportion of Ni particles. However, beyond 5%Ni, the increasing rate slows down with the Ni volume fraction. Calculation shows that the shear strengths of composite solder joints with 5 vol% Ni particles could increase about 30% as compared to the Sn-3.5Ag solder joint. The morphology of the intermetallic compounds (IMC) both at the Cu-solder interfaces and around Ni reinforcement particles were analyzed. The spreading areas of composite solder with different Ni particles additions on Cu substrate were calculated. Sn3.5Ag composite solder reinforced with 1% Ni particles spread into the most circular shape and its visual surface qualities were better as compared to other composite solders on Cu substrate. The spreading areas increased more than 15% under this condition. The spreading area decreased with increasing Ni volume fraction beyond 1%Ni. When the proportion increased to 5%, the spreading area of composite solders dropped back to that of Sn-3.5Ag solder" @default.
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• W2153104964 date "2006-01-01" @default.
• W2153104964 modified "2023-09-26" @default.
• W2153104964 title "Effects of Ni particle addition on microstructure and properties of SnAg based composite solders" @default.
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• W2153104964 doi "https://doi.org/10.1109/eptc.2006.342801" @default.
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