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- W2153222617 abstract "The objective of this study is to analyze the performance of a cylindrical pin-fin heat sink in laminar forced convection. The mathematical models are presented for predicting thermal and hydraulic resistances for both in-line and staggered arrangements. Analytical/empirical correlations of friction and heat transfer coefficients are used in the analysis. The analyses are performed by using parametric variation of resistances. The effects of thermal joint, spreading, and contact resistances as well as the thermal conductivity on the overall thermal performance are examined. For a given size and heat load, it is observed that the overall performance of a pin-fin heat sink depends on a number of parameters including the dimensions of the pin-fins, pin density, longitudinal and transverse spacings, interface material, location and size of heat sources, method of manufacturing, type of heat-sink material, approach velocity, and arrangement of pins. It is also observed that the thermal resistance decreases whereas pressure drop increases with an increase in approach velocity, pin diameter, and pin density. Nomenclature Ab = area of the base plate ≡ L × W ,m 2 Ac = cross-section or contact area of a single pin, m 2 Afin = surface area of a single pin, m 2 Ahs = surface area of heat sink, m 2 CV = control volume D = pin diameter, m f = friction factor H = pin height, m h = average heat transfer coefficient, W/m 2 · K he = uniform effective film coefficient, W/m 2 · K k = thermal conductivity, W/m · K ks = harmonic mean thermal conductivity for the two solids, W/m · K L = length of heat sink in flow direction, m m = fin performance parameter, m −1 N = total number of pins in heat sink ≡ NT NL NL = number of pins in the longitudinal direction NT = number of pins in the transverse direction Nu D = Nusselt number based on pin diameter ≡ Dh/k f P = contact pressure, N/m 2 Pr = Prandtl number ≡ ν/α Q = total heat transfer rate, W Rc = contact resistance between fins and the baseplate, K/W R f = total resistance of fluid side of heat sink, K/W Rfilm = thermal resistance of exposed (unfinned) surface of the baseplate, K/W Rfin = resistance of a fin, K/W R j = thermal joint resistance between the source and the baseplate, K/W Rm = material resistance of the baseplate, K/W Rs = thermal spreading resistance in the baseplate, K/W" @default.
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- W2153222617 date "2006-07-01" @default.
- W2153222617 modified "2023-09-25" @default.
- W2153222617 title "Performance of Shrouded Pin-Fin Heat Sinks for Electronic Cooling" @default.
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- W2153222617 doi "https://doi.org/10.2514/1.17713" @default.
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