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- W2154083318 abstract "In-System Programmability (ISP) is solving design challenges in many diverse applications such as very-high-density board configurations and multi-chip modules (MCMs). These applications can no longer use sockets, through-hole PGA's, or even PLCC packages, and are rapidly moving towards fine-pin-pitch Quad Flat Packages (QFP) or no package at all. These new packaging trends address the device handling and programming issues, such as solderability and bent pin handling which designers currently face. This paper discusses ISP technology and the advantages of designing with Lattice's ispLSI devices. >" @default.
- W2154083318 created "2016-06-24" @default.
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- W2154083318 date "2002-12-17" @default.
- W2154083318 modified "2023-09-26" @default.
- W2154083318 title "In system programming, the future for high density devices" @default.
- W2154083318 doi "https://doi.org/10.1109/wescon.1994.403522" @default.
- W2154083318 hasPublicationYear "2002" @default.
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