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- W2154203472 abstract "This paper presents a dual-folded-dipole array integrated in a thin cavity-down ball grid array chip-scale package for highly-integrated 60-GHz radios. Realized in a low temperature cofired ceramic (LTCC) technology, the package measures 12.5×8×1.265 mm3 and can carry a 60-GHz radio die of current size. The antenna array is designed to cover a 7-GHz bandwidth from 57 to 64 GHz to suit the allocated frequency range. It achieves return loss more than 8 dB, gain 9 ± 2.5dBi and radiation efficiency of better than 90% over the bandwidth, which clearly demonstrates the feasibility of the elegant antenna-array-in-chip-package solution for emerging short-range high-speed 60-GHz wireless personal area network (WPAN) systems [1–5]." @default.
- W2154203472 created "2016-06-24" @default.
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- W2154203472 date "2010-07-01" @default.
- W2154203472 modified "2023-09-25" @default.
- W2154203472 title "Dual-folded-dipole-array in chip package for single-chip 60-GHz radios" @default.
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- W2154203472 doi "https://doi.org/10.1109/aps.2010.5561723" @default.
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