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- W2154207880 abstract "This work examined the thermal stability of Reillex(tm) HPQ resin as part of a comprehensive plan to qualify that material for use in HB-line. No low temperature exothermic reactions or volatile organic compounds occurred in various lots of as-received, chloride form Reillex(tm) HPQ polymer or the nitrate form polymer. The studies do not suggest any restrictions on purchase criteria for the resin nor any changes in planned use. Previously observed low temperature exotherms resulted from reaction of nitric acid with the aluminum sample holders used in the Differential Scanning Calorimetry analysis." @default.
- W2154207880 created "2016-06-24" @default.
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- W2154207880 date "1998-12-17" @default.
- W2154207880 modified "2023-09-24" @default.
- W2154207880 title "Characterization of Reillex{trademark} HPQ Polymer" @default.
- W2154207880 doi "https://doi.org/10.2172/4843" @default.
- W2154207880 hasPublicationYear "1998" @default.
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