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- W2154513612 abstract "A novel model for simulating Physical Vapor Deposition (PVD) systems is presented. The model determines profile evolution for deposition in trenches and vias by considering the major components in a PVD system. The simulator incorporates the effects of non-uniform target erosion, collimation, gas phase collisions, and particle sticking coefficients on profile evolution. Simulations for sputtered Ti are compared against experimental results. >" @default.
- W2154513612 created "2016-06-24" @default.
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- W2154513612 date "2002-12-17" @default.
- W2154513612 modified "2023-09-27" @default.
- W2154513612 title "Modeling of Ti physical vapor deposition systems" @default.
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- W2154513612 doi "https://doi.org/10.1109/nupad.1994.343495" @default.
- W2154513612 hasPublicationYear "2002" @default.
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