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• W2154879312 abstract "In this paper we present results from measurements on epoxy-based anisotropic and isotropic, electrically conductive adhesives, ACAs and ICAs respectively. We study two different types of connections, a flip-chip bonded silicon test chips and a simple transmission line gap bridged by a copper foil. These measurements are referenced to equivalent solder joints. The silicon chip is a standard test chip. The test chips are mounted on three different substrates, a rigid FR-4 board, flexible board and a high-frequency Teflon-based duroid substrate. We also discuss two electrical models for the connections, an equivalent RC model and a stochastic model, based on random particle distribution. The equivalent electrical model is based on physical considerations and the parameters are then fitted to measurement data in the high frequency CAD tool HP MDS. All the adhesive and solder interconnections are measured before and after temperature cycling and humidity tests. The temperature dependence of the connections S-parameters are also studied in a temperature controlled environment. A HP8510 network analyzer is used to measure scattering parameters. On rigid and flexible boards, the frequency range investigated is 500 MHz to 8 GHz, and on duroid mounted flip-chips and bridges, the range is 1 GHz to 30 GHz. The Thru-Reflect-Line calibration procedure is used to get the best possible calibration. Power testing is used with the Cu bridge assembly to find the maximum power transmission through an electrically conductive adhesive interconnect. This is done at relevant microwave frequencies. Results indicate that the isotropic adhesive interconnections handle high power throughput well. The adhesive joints are subjected to a maximum peak pulsed power of 250 W. Maximum work factor of the pulsed signal is 10%. The effects of different particle sizes and materials in the ACAs are systematically investigated. Three different particle sizes and two particle materials are examined. All adhesives considered show similar electrical properties and are all suitable for adhesive electrical interconnections. The microstructure of the adhesive joints is studied by cross-sectioning using Scanning Electron Microscopy (SEM) before and after temperature cycling." @default.
• W2154879312 created "2016-06-24" @default.
• W2154879312 creator A5017504264 @default.
• W2154879312 creator A5035766233 @default.
• W2154879312 creator A5036070737 @default.
• W2154879312 creator A5036742629 @default.
• W2154879312 creator A5037654448 @default.
• W2154879312 creator A5058735692 @default.
• W2154879312 date "2002-11-27" @default.
• W2154879312 modified "2023-10-18" @default.
• W2154879312 title "Electrically conductive adhesives at microwave frequencies" @default.
• W2154879312 cites W2044782411 @default.
• W2154879312 cites W2111068907 @default.
• W2154879312 cites W2143485129 @default.
• W2154879312 doi "https://doi.org/10.1109/ectc.1998.678839" @default.
• W2154879312 hasPublicationYear "2002" @default.
• W2154879312 type Work @default.
• W2154879312 sameAs 2154879312 @default.
• W2154879312 citedByCount "16" @default.
• W2154879312 countsByYear W21548793122013 @default.
• W2154879312 countsByYear W21548793122016 @default.
• W2154879312 countsByYear W21548793122022 @default.
• W2154879312 crossrefType "proceedings-article" @default.
• W2154879312 hasAuthorship W2154879312A5017504264 @default.
• W2154879312 hasAuthorship W2154879312A5035766233 @default.
• W2154879312 hasAuthorship W2154879312A5036070737 @default.
• W2154879312 hasAuthorship W2154879312A5036742629 @default.
• W2154879312 hasAuthorship W2154879312A5037654448 @default.
• W2154879312 hasAuthorship W2154879312A5058735692 @default.
• W2154879312 hasConcept C119599485 @default.
• W2154879312 hasConcept C121332964 @default.
• W2154879312 hasConcept C127413603 @default.
• W2154879312 hasConcept C159985019 @default.
• W2154879312 hasConcept C192562407 @default.
• W2154879312 hasConcept C202374169 @default.
• W2154879312 hasConcept C24890656 @default.
• W2154879312 hasConcept C2779227376 @default.
• W2154879312 hasConcept C41008148 @default.
• W2154879312 hasConcept C44838205 @default.
• W2154879312 hasConcept C49040817 @default.
• W2154879312 hasConcept C68928338 @default.
• W2154879312 hasConcept C76155785 @default.
• W2154879312 hasConceptScore W2154879312C119599485 @default.
• W2154879312 hasConceptScore W2154879312C121332964 @default.
• W2154879312 hasConceptScore W2154879312C127413603 @default.
• W2154879312 hasConceptScore W2154879312C159985019 @default.
• W2154879312 hasConceptScore W2154879312C192562407 @default.
• W2154879312 hasConceptScore W2154879312C202374169 @default.
• W2154879312 hasConceptScore W2154879312C24890656 @default.
• W2154879312 hasConceptScore W2154879312C2779227376 @default.
• W2154879312 hasConceptScore W2154879312C41008148 @default.
• W2154879312 hasConceptScore W2154879312C44838205 @default.
• W2154879312 hasConceptScore W2154879312C49040817 @default.
• W2154879312 hasConceptScore W2154879312C68928338 @default.
• W2154879312 hasConceptScore W2154879312C76155785 @default.
• W2154879312 hasLocation W21548793121 @default.
• W2154879312 hasOpenAccess W2154879312 @default.
• W2154879312 hasPrimaryLocation W21548793121 @default.
• W2154879312 hasRelatedWork W1917356104 @default.
• W2154879312 hasRelatedWork W1963684115 @default.
• W2154879312 hasRelatedWork W2168702377 @default.
• W2154879312 hasRelatedWork W2366970374 @default.
• W2154879312 hasRelatedWork W2381942348 @default.
• W2154879312 hasRelatedWork W2389731263 @default.
• W2154879312 hasRelatedWork W2954843042 @default.
• W2154879312 hasRelatedWork W4232026772 @default.
• W2154879312 hasRelatedWork W4241550722 @default.
• W2154879312 hasRelatedWork W2463824739 @default.
• W2154879312 isParatext "false" @default.
• W2154879312 isRetracted "false" @default.
• W2154879312 magId "2154879312" @default.
• W2154879312 workType "article" @default.