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• W2155402969 endingPage "738" @default.
• W2155402969 startingPage "732" @default.
• W2155402969 abstract "This paper describes a method for fabricating micronozzles using low-temperature wafer-level adhesive bonding with SU-8. The influence of different parameters on the bonding of structured wafers has been investigated. The surface energies of bonded wafers are measured to be in the range of 0.42–0.56 J m−2, which are comparable to those of some directly bonded wafers. Converging–diverging nozzle structures with throat widths as small as 3.6 µm are formed in an SU-8 film bonded with another SU-8 intermediate layer to produce sealed micronozzles. A novel interconnection technique is developed to interface and test the micronozzles with a macroscopic fluid delivery system to demonstrate the feasibility of the fabrication process. Leakage test results show that this low-temperature wafer bonding process is a viable MEMS fabrication technique for microfluidic applications." @default.
• W2155402969 created "2016-06-24" @default.
• W2155402969 creator A5026512168 @default.
• W2155402969 creator A5055182942 @default.
• W2155402969 creator A5065907278 @default.
• W2155402969 creator A5082285398 @default.
• W2155402969 date "2003-06-20" @default.
• W2155402969 modified "2023-09-26" @default.
• W2155402969 title "Fabrication of micronozzles using low-temperature wafer-level bonding with SU-8" @default.
• W2155402969 cites W2000186646 @default.
• W2155402969 cites W2023923307 @default.
• W2155402969 cites W2026812371 @default.
• W2155402969 cites W2028567428 @default.
• W2155402969 cites W2029861332 @default.
• W2155402969 cites W2042232015 @default.
• W2155402969 cites W2078298270 @default.
• W2155402969 cites W2080393159 @default.
• W2155402969 cites W2082983861 @default.
• W2155402969 cites W2086025153 @default.
• W2155402969 cites W2092079250 @default.
• W2155402969 cites W2142303686 @default.
• W2155402969 cites W2157176206 @default.
• W2155402969 doi "https://doi.org/10.1088/0960-1317/13/5/328" @default.
• W2155402969 hasPublicationYear "2003" @default.
• W2155402969 type Work @default.
• W2155402969 sameAs 2155402969 @default.
• W2155402969 citedByCount "86" @default.
• W2155402969 countsByYear W21554029692012 @default.
• W2155402969 countsByYear W21554029692013 @default.
• W2155402969 countsByYear W21554029692014 @default.
• W2155402969 countsByYear W21554029692015 @default.
• W2155402969 countsByYear W21554029692016 @default.
• W2155402969 countsByYear W21554029692017 @default.
• W2155402969 countsByYear W21554029692018 @default.
• W2155402969 countsByYear W21554029692019 @default.
• W2155402969 countsByYear W21554029692020 @default.
• W2155402969 countsByYear W21554029692021 @default.
• W2155402969 countsByYear W21554029692022 @default.
• W2155402969 crossrefType "journal-article" @default.
• W2155402969 hasAuthorship W2155402969A5026512168 @default.
• W2155402969 hasAuthorship W2155402969A5055182942 @default.
• W2155402969 hasAuthorship W2155402969A5065907278 @default.
• W2155402969 hasAuthorship W2155402969A5082285398 @default.
• W2155402969 hasConcept C123745756 @default.
• W2155402969 hasConcept C127413603 @default.
• W2155402969 hasConcept C136525101 @default.
• W2155402969 hasConcept C139719470 @default.
• W2155402969 hasConcept C142724271 @default.
• W2155402969 hasConcept C159985019 @default.
• W2155402969 hasConcept C160671074 @default.
• W2155402969 hasConcept C162324750 @default.
• W2155402969 hasConcept C171250308 @default.
• W2155402969 hasConcept C192562407 @default.
• W2155402969 hasConcept C201414436 @default.
• W2155402969 hasConcept C204787440 @default.
• W2155402969 hasConcept C2777042071 @default.
• W2155402969 hasConcept C2779133538 @default.
• W2155402969 hasConcept C2779227376 @default.
• W2155402969 hasConcept C37977207 @default.
• W2155402969 hasConcept C49040817 @default.
• W2155402969 hasConcept C56200935 @default.
• W2155402969 hasConcept C68928338 @default.
• W2155402969 hasConcept C71924100 @default.
• W2155402969 hasConcept C76155785 @default.
• W2155402969 hasConcept C78519656 @default.
• W2155402969 hasConceptScore W2155402969C123745756 @default.
• W2155402969 hasConceptScore W2155402969C127413603 @default.
• W2155402969 hasConceptScore W2155402969C136525101 @default.
• W2155402969 hasConceptScore W2155402969C139719470 @default.
• W2155402969 hasConceptScore W2155402969C142724271 @default.
• W2155402969 hasConceptScore W2155402969C159985019 @default.
• W2155402969 hasConceptScore W2155402969C160671074 @default.
• W2155402969 hasConceptScore W2155402969C162324750 @default.
• W2155402969 hasConceptScore W2155402969C171250308 @default.
• W2155402969 hasConceptScore W2155402969C192562407 @default.
• W2155402969 hasConceptScore W2155402969C201414436 @default.
• W2155402969 hasConceptScore W2155402969C204787440 @default.
• W2155402969 hasConceptScore W2155402969C2777042071 @default.
• W2155402969 hasConceptScore W2155402969C2779133538 @default.
• W2155402969 hasConceptScore W2155402969C2779227376 @default.
• W2155402969 hasConceptScore W2155402969C37977207 @default.
• W2155402969 hasConceptScore W2155402969C49040817 @default.
• W2155402969 hasConceptScore W2155402969C56200935 @default.
• W2155402969 hasConceptScore W2155402969C68928338 @default.
• W2155402969 hasConceptScore W2155402969C71924100 @default.
• W2155402969 hasConceptScore W2155402969C76155785 @default.
• W2155402969 hasConceptScore W2155402969C78519656 @default.
• W2155402969 hasIssue "5" @default.
• W2155402969 hasLocation W21554029691 @default.
• W2155402969 hasOpenAccess W2155402969 @default.
• W2155402969 hasPrimaryLocation W21554029691 @default.
• W2155402969 hasRelatedWork W1580201804 @default.
• W2155402969 hasRelatedWork W1853667117 @default.
• W2155402969 hasRelatedWork W1990064372 @default.
• W2155402969 hasRelatedWork W2007557890 @default.
• W2155402969 hasRelatedWork W2020747132 @default.
• W2155402969 hasRelatedWork W2028462573 @default.
• W2155402969 hasRelatedWork W2073433502 @default.

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